JPS5361982A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS5361982A JPS5361982A JP13766476A JP13766476A JPS5361982A JP S5361982 A JPS5361982 A JP S5361982A JP 13766476 A JP13766476 A JP 13766476A JP 13766476 A JP13766476 A JP 13766476A JP S5361982 A JPS5361982 A JP S5361982A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- circuit device
- forming
- junction diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12036—PN diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Bipolar Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13766476A JPS5361982A (en) | 1976-11-15 | 1976-11-15 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13766476A JPS5361982A (en) | 1976-11-15 | 1976-11-15 | Semiconductor integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5361982A true JPS5361982A (en) | 1978-06-02 |
Family
ID=15203920
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13766476A Pending JPS5361982A (en) | 1976-11-15 | 1976-11-15 | Semiconductor integrated circuit device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5361982A (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57139957A (en) * | 1981-02-24 | 1982-08-30 | Mitsubishi Electric Corp | Protective diode of semiconductor integrated circuit device |
JPS57188350U (ja) * | 1981-05-27 | 1982-11-30 | ||
JPS5811236U (ja) * | 1981-07-15 | 1983-01-25 | 日本電気株式会社 | 電気部品 |
JPS5887363U (ja) * | 1981-12-10 | 1983-06-14 | 沖電気工業株式会社 | 半導体装置 |
JPH01262654A (ja) * | 1988-04-14 | 1989-10-19 | Toshiba Corp | 半導体装置 |
JPH02146850U (ja) * | 1989-05-12 | 1990-12-13 | ||
JPH04206768A (ja) * | 1990-11-30 | 1992-07-28 | Yamaha Corp | 半導体装置の保護回路 |
US6672823B2 (en) | 2001-09-11 | 2004-01-06 | Cascade Corporation | Fork positioner for facilitating replacement of forks on lift trucks |
US7909563B2 (en) | 2004-11-30 | 2011-03-22 | Cascade Corporation | Fork positioner |
US8403618B2 (en) | 2004-11-30 | 2013-03-26 | Cascade Corporation | Lift truck load handler |
JP2015072990A (ja) * | 2013-10-02 | 2015-04-16 | サンケン電気株式会社 | 半導体装置 |
-
1976
- 1976-11-15 JP JP13766476A patent/JPS5361982A/ja active Pending
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57139957A (en) * | 1981-02-24 | 1982-08-30 | Mitsubishi Electric Corp | Protective diode of semiconductor integrated circuit device |
JPS57188350U (ja) * | 1981-05-27 | 1982-11-30 | ||
JPS5811236U (ja) * | 1981-07-15 | 1983-01-25 | 日本電気株式会社 | 電気部品 |
JPS5887363U (ja) * | 1981-12-10 | 1983-06-14 | 沖電気工業株式会社 | 半導体装置 |
JPH0553303B2 (ja) * | 1988-04-14 | 1993-08-09 | Tokyo Shibaura Electric Co | |
JPH01262654A (ja) * | 1988-04-14 | 1989-10-19 | Toshiba Corp | 半導体装置 |
JPH02146850U (ja) * | 1989-05-12 | 1990-12-13 | ||
JPH04206768A (ja) * | 1990-11-30 | 1992-07-28 | Yamaha Corp | 半導体装置の保護回路 |
US6672823B2 (en) | 2001-09-11 | 2004-01-06 | Cascade Corporation | Fork positioner for facilitating replacement of forks on lift trucks |
US7008167B2 (en) | 2001-09-11 | 2006-03-07 | Cascade Corporation | Fork positioner for facilitating replacement of forks on lift trucks |
US7909563B2 (en) | 2004-11-30 | 2011-03-22 | Cascade Corporation | Fork positioner |
US8403618B2 (en) | 2004-11-30 | 2013-03-26 | Cascade Corporation | Lift truck load handler |
JP2015072990A (ja) * | 2013-10-02 | 2015-04-16 | サンケン電気株式会社 | 半導体装置 |
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