JPS535286A - Reinforced flexible printed wiring plate - Google Patents

Reinforced flexible printed wiring plate

Info

Publication number
JPS535286A
JPS535286A JP7798777A JP7798777A JPS535286A JP S535286 A JPS535286 A JP S535286A JP 7798777 A JP7798777 A JP 7798777A JP 7798777 A JP7798777 A JP 7798777A JP S535286 A JPS535286 A JP S535286A
Authority
JP
Japan
Prior art keywords
printed wiring
flexible printed
wiring plate
reinforced flexible
reinforced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7798777A
Other languages
English (en)
Inventor
Harold Klein Theodore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of JPS535286A publication Critical patent/JPS535286A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP7798777A 1976-07-01 1977-07-01 Reinforced flexible printed wiring plate Pending JPS535286A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/701,591 US4103102A (en) 1976-07-01 1976-07-01 Reinforced flexible printed wiring board

Publications (1)

Publication Number Publication Date
JPS535286A true JPS535286A (en) 1978-01-18

Family

ID=24817954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7798777A Pending JPS535286A (en) 1976-07-01 1977-07-01 Reinforced flexible printed wiring plate

Country Status (6)

Country Link
US (1) US4103102A (ja)
JP (1) JPS535286A (ja)
DE (1) DE2729655A1 (ja)
FR (1) FR2357143A1 (ja)
GB (1) GB1563379A (ja)
NL (1) NL7707210A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5829864U (ja) * 1981-08-20 1983-02-26 セイコーエプソン株式会社 フレキシブルプリント配線板材料
JPS60146987U (ja) * 1984-03-12 1985-09-30 ソニー株式会社 テ−プカセツト

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4282011A (en) * 1980-05-30 1981-08-04 Dan River Incorporated Woven fabrics containing glass fibers and abrasive belts made from same
US4318954A (en) * 1981-02-09 1982-03-09 Boeing Aerospace Company Printed wiring board substrates for ceramic chip carriers
US4513055A (en) * 1981-11-30 1985-04-23 Trw Inc. Controlled thermal expansion composite and printed circuit board embodying same
FR2543780B1 (fr) * 1983-03-31 1990-02-23 Rogers Corp Circuit electrique flexible conservant sa forme et procede de fabrication de ce circuit
DE3316362C2 (de) * 1983-05-05 1985-03-07 Dynamit Nobel Ag, 5210 Troisdorf Schichtpreßstoff auf Epoxydharzbasis für gedruckte Schaltungen
US4795693A (en) * 1983-07-13 1989-01-03 American Telephone And Telegraph Company, At&T Technologies, Inc. Multilayer circuit board fabrication process
US4628022A (en) * 1983-07-13 1986-12-09 At&T Technologies, Inc. Multilayer circuit board fabrication process and polymer insulator used therein
US4511757A (en) * 1983-07-13 1985-04-16 At&T Technologies, Inc. Circuit board fabrication leading to increased capacity
DE3420042C1 (de) * 1984-05-29 1985-03-14 Dynamit Nobel Ag Zeichenfolie
US4609586A (en) * 1984-08-02 1986-09-02 The Boeing Company Thermally conductive printed wiring board laminate
DE3434672C2 (de) * 1984-09-21 1986-09-11 Fa. Carl Freudenberg, 6940 Weinheim Verfahren zur Herstellung von flexiblen Leiterplatten für hohe Biegebeanspruchung
US4800114A (en) * 1986-08-15 1989-01-24 Cichanowski Michael F Fiber and resin construction
US5201974A (en) * 1990-02-06 1993-04-13 West Frederick A Method and apparatus for making patterned electrically conductive structures
WO1996015306A1 (fr) * 1994-11-15 1996-05-23 Mitsubishi Gas Chemical Company, Ltd. Materiau en feuille pour stratifie de circuit imprime et stratifie pour circuit imprime
JP3324916B2 (ja) * 1995-10-16 2002-09-17 日東紡績株式会社 ガラスクロス、プリプレグ、積層板及び多層プリント配線板
US6059917A (en) * 1995-12-08 2000-05-09 Texas Instruments Incorporated Control of parallelism during semiconductor die attach
US6783620B1 (en) 1998-10-13 2004-08-31 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6114015A (en) * 1998-10-13 2000-09-05 Matsushita Electronic Materials, Inc. Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
US6395121B1 (en) 1999-02-04 2002-05-28 Chartpak, Inc. Method for making fabric-based, adhesively mounted printed circuit for upholstered seats and the like
EP1335831B1 (en) * 2000-10-16 2011-01-05 Foster-Miller, Inc. Methods of manufacturing a fabric article including electronic circuitry and fabric articles
JP2003136623A (ja) * 2001-08-22 2003-05-14 Tdk Corp モジュール部品、コア基板要素集合体、多層基板、コア基板要素集合体の製造方法、多層基板の製造方法、及びモジュール部品の製造方法
US7056571B2 (en) * 2002-12-24 2006-06-06 Matsushita Electric Industrial Co., Ltd. Wiring board and its production process
GB0312550D0 (en) * 2003-06-02 2003-07-09 Nel Technologies Ltd Functional insole heater for footwear
US7022919B2 (en) * 2003-06-30 2006-04-04 Intel Corporation Printed circuit board trace routing method
EP1659940B1 (en) 2003-08-22 2014-07-23 Foster-Miller, Inc. Physiological monitoring garment
US7312401B2 (en) * 2004-09-21 2007-12-25 Ibiden Co., Ltd. Flexible printed wiring board
US20070182436A1 (en) * 2006-02-07 2007-08-09 Sun Microsystems, Inc. Technique for offsetting signal lines from the glass weave of resin/glass materials
US7427719B2 (en) * 2006-03-21 2008-09-23 Intel Corporation Shifted segment layout for differential signal traces to mitigate bundle weave effect
ATE437556T1 (de) * 2006-05-12 2009-08-15 Delphi Tech Inc Flexibles schichtsystem
US7615705B2 (en) * 2006-07-14 2009-11-10 International Business Machines Corporation Enhanced-reliability printed circuit board for tight-pitch components
KR101408510B1 (ko) * 2007-05-18 2014-06-17 삼성전자주식회사 표시소자용 연성기판 및 이를 이용한 디스플레이 소자
JP2009164174A (ja) * 2007-12-28 2009-07-23 Fujitsu Ltd プリント配線板およびプリント基板ユニット
JP2009164416A (ja) * 2008-01-08 2009-07-23 Fujitsu Ltd プリント配線板およびプリント基板ユニット
JP2011080170A (ja) * 2009-10-09 2011-04-21 Sumitomo Chemical Co Ltd ガラスクロス含浸基材の製造方法およびプリント配線板
US9211085B2 (en) 2010-05-03 2015-12-15 Foster-Miller, Inc. Respiration sensing system
US9028404B2 (en) 2010-07-28 2015-05-12 Foster-Miller, Inc. Physiological status monitoring system
US8585606B2 (en) 2010-09-23 2013-11-19 QinetiQ North America, Inc. Physiological status monitoring system
USD861633S1 (en) * 2015-04-22 2019-10-01 Zound Industries International Ab Headphone with surface treatment
CN106337237B (zh) 2015-07-07 2020-02-18 恩智浦美国有限公司 用于可穿戴电子装置的编织的信号路由基底

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2350504A (en) * 1943-07-16 1944-06-06 Ernest C Geier Yarn
US2448782A (en) * 1945-05-14 1948-09-07 Archibald H Davis Composite strand and fabric
US2729933A (en) * 1952-07-12 1956-01-10 Schlichter Jute Cordage Compan Twine
GB1085098A (en) * 1964-06-23 1967-09-27 Bba Group Ltd Improvements in or relating to yarn and fabric made therefrom
US3572397A (en) * 1968-12-27 1971-03-23 Uniroyal Inc Noncombustion-supporting fabric
US3940534A (en) * 1973-11-07 1976-02-24 G. T. Schjeldahl Company Electrical laminate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5829864U (ja) * 1981-08-20 1983-02-26 セイコーエプソン株式会社 フレキシブルプリント配線板材料
JPS60146987U (ja) * 1984-03-12 1985-09-30 ソニー株式会社 テ−プカセツト

Also Published As

Publication number Publication date
FR2357143A1 (fr) 1978-01-27
NL7707210A (nl) 1978-01-03
GB1563379A (en) 1980-03-26
US4103102A (en) 1978-07-25
DE2729655A1 (de) 1978-01-05

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