JPS5352057A - Continous wafer molding unit - Google Patents

Continous wafer molding unit

Info

Publication number
JPS5352057A
JPS5352057A JP12701976A JP12701976A JPS5352057A JP S5352057 A JPS5352057 A JP S5352057A JP 12701976 A JP12701976 A JP 12701976A JP 12701976 A JP12701976 A JP 12701976A JP S5352057 A JPS5352057 A JP S5352057A
Authority
JP
Japan
Prior art keywords
continous
wafer
molding unit
wafer molding
moved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12701976A
Other languages
Japanese (ja)
Inventor
Asaji Kawanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP12701976A priority Critical patent/JPS5352057A/en
Publication of JPS5352057A publication Critical patent/JPS5352057A/en
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE: To form the molded part of a uniform dimension at the outside circumference with a wafer rotated to be moved, by engaging a wafer support stand and a pair of pushingin bars to give a constitution - where individual movement is possible - when the wafer is moved in an etching atmosphere.
COPYRIGHT: (C)1978,JPO&Japio
JP12701976A 1976-10-22 1976-10-22 Continous wafer molding unit Pending JPS5352057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12701976A JPS5352057A (en) 1976-10-22 1976-10-22 Continous wafer molding unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12701976A JPS5352057A (en) 1976-10-22 1976-10-22 Continous wafer molding unit

Publications (1)

Publication Number Publication Date
JPS5352057A true JPS5352057A (en) 1978-05-12

Family

ID=14949667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12701976A Pending JPS5352057A (en) 1976-10-22 1976-10-22 Continous wafer molding unit

Country Status (1)

Country Link
JP (1) JPS5352057A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758320A (en) * 1980-09-24 1982-04-08 Hitachi Ltd Work mounting stage in plasma asher device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5758320A (en) * 1980-09-24 1982-04-08 Hitachi Ltd Work mounting stage in plasma asher device

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