JPS5758320A - Work mounting stage in plasma asher device - Google Patents

Work mounting stage in plasma asher device

Info

Publication number
JPS5758320A
JPS5758320A JP13167380A JP13167380A JPS5758320A JP S5758320 A JPS5758320 A JP S5758320A JP 13167380 A JP13167380 A JP 13167380A JP 13167380 A JP13167380 A JP 13167380A JP S5758320 A JPS5758320 A JP S5758320A
Authority
JP
Japan
Prior art keywords
wafer
work
periphery
groove
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13167380A
Other languages
Japanese (ja)
Inventor
Atsushi Fujisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13167380A priority Critical patent/JPS5758320A/en
Publication of JPS5758320A publication Critical patent/JPS5758320A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3435—Target holders (includes backing plates and endblocks)

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

PURPOSE:To completely remove the material deposited on the periphery of the lower surface of the work by constituting the stage so that the center of the lower surface of the work is supported, and a space is provided under the peripheral part of the work. CONSTITUTION:The stage 5 is of a disc shape, and a doughnut shaped groove 7 is concentrically provided in a work mount 6 on the upper surface thereof. The circumference of a circle is located in the middle between the inner circumferential fringe and the outer circumferential fringe of said groove, and diameter of said circle is coincided with that of a wafer 1 which is the work. Therefore, when the wafer 1 is mounted on the specified position of the stage 5, the outer periphery of the wafer 1 is located on the groove 7. When plasma treatment is applied, the plasma reaches not only the upper surface of the wafer but also the periphery of the lower surface of the wafer 1 through groove 7. Therefore, the resist which is attached to the periphery of the lower surface of the wafer 1 can be ashed and removed.
JP13167380A 1980-09-24 1980-09-24 Work mounting stage in plasma asher device Pending JPS5758320A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13167380A JPS5758320A (en) 1980-09-24 1980-09-24 Work mounting stage in plasma asher device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13167380A JPS5758320A (en) 1980-09-24 1980-09-24 Work mounting stage in plasma asher device

Publications (1)

Publication Number Publication Date
JPS5758320A true JPS5758320A (en) 1982-04-08

Family

ID=15063547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13167380A Pending JPS5758320A (en) 1980-09-24 1980-09-24 Work mounting stage in plasma asher device

Country Status (1)

Country Link
JP (1) JPS5758320A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62116891U (en) * 1986-01-17 1987-07-24
KR100384060B1 (en) * 2000-12-04 2003-05-14 삼성전자주식회사 chuck plate of ashing equipment for fabricating semiconductor device and chuck assembly having same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352057A (en) * 1976-10-22 1978-05-12 Toshiba Corp Continous wafer molding unit
JPS5555530A (en) * 1978-10-18 1980-04-23 Takuo Sugano Electrode device for plasma processor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5352057A (en) * 1976-10-22 1978-05-12 Toshiba Corp Continous wafer molding unit
JPS5555530A (en) * 1978-10-18 1980-04-23 Takuo Sugano Electrode device for plasma processor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62116891U (en) * 1986-01-17 1987-07-24
JPH0423029Y2 (en) * 1986-01-17 1992-05-27
KR100384060B1 (en) * 2000-12-04 2003-05-14 삼성전자주식회사 chuck plate of ashing equipment for fabricating semiconductor device and chuck assembly having same

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