JPS5348465A - Connecting method of lead frame utilizing through-holes - Google Patents
Connecting method of lead frame utilizing through-holesInfo
- Publication number
- JPS5348465A JPS5348465A JP12275276A JP12275276A JPS5348465A JP S5348465 A JPS5348465 A JP S5348465A JP 12275276 A JP12275276 A JP 12275276A JP 12275276 A JP12275276 A JP 12275276A JP S5348465 A JPS5348465 A JP S5348465A
- Authority
- JP
- Japan
- Prior art keywords
- holes
- lead frame
- connecting method
- frame utilizing
- utilizing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12275276A JPS5348465A (en) | 1976-10-15 | 1976-10-15 | Connecting method of lead frame utilizing through-holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12275276A JPS5348465A (en) | 1976-10-15 | 1976-10-15 | Connecting method of lead frame utilizing through-holes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5348465A true JPS5348465A (en) | 1978-05-01 |
| JPS5729852B2 JPS5729852B2 (OSRAM) | 1982-06-25 |
Family
ID=14843718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12275276A Granted JPS5348465A (en) | 1976-10-15 | 1976-10-15 | Connecting method of lead frame utilizing through-holes |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5348465A (OSRAM) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111158U (OSRAM) * | 1984-05-15 | 1986-07-14 | ||
| JPS61205150U (OSRAM) * | 1986-05-15 | 1986-12-24 | ||
| JPH01187995A (ja) * | 1988-01-22 | 1989-07-27 | Ibiden Co Ltd | 電子部品搭載用連続基板とその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4814154U (OSRAM) * | 1971-06-25 | 1973-02-16 |
-
1976
- 1976-10-15 JP JP12275276A patent/JPS5348465A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4814154U (OSRAM) * | 1971-06-25 | 1973-02-16 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61111158U (OSRAM) * | 1984-05-15 | 1986-07-14 | ||
| JPS61205150U (OSRAM) * | 1986-05-15 | 1986-12-24 | ||
| JPH01187995A (ja) * | 1988-01-22 | 1989-07-27 | Ibiden Co Ltd | 電子部品搭載用連続基板とその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5729852B2 (OSRAM) | 1982-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IT8022777A0 (it) | Dispositivo per lo smontaggio nondistributivo d'un componente elettronico modlere saldato mediante una pluraliya' di terminali di raccordo su un substrato. | |
| JPS522277A (en) | Soldering device | |
| JPS5348465A (en) | Connecting method of lead frame utilizing through-holes | |
| JPS522376A (en) | Ic elements connecting mechanism | |
| JPS5385159A (en) | Production of using semiconductor support and semiconductor device usingsemiconductor support | |
| JPS5211581A (en) | Product conveyer device | |
| JPS51142978A (en) | Mounting method of circuit elements | |
| JPS51117574A (en) | Semiconductor equipment | |
| JPS51151069A (en) | Electrode forming method of a semiconductor element | |
| JPS522170A (en) | Electronic parts | |
| JPS5341177A (en) | Mounting method of electronic parts | |
| JPS5437294A (en) | Conductor support | |
| JPS5313873A (en) | Tape carrier | |
| JPS5212572A (en) | Semi-conductor device | |
| JPS5288995A (en) | Apparatus for mounting propeller | |
| JPS5254373A (en) | Packaging construction for semiconductor element | |
| JPS5216978A (en) | Semiconductor | |
| JPS5235901A (en) | Selective station display circuit | |
| JPS52143186A (en) | Taping device | |
| JPS53124976A (en) | Mounting method of electronic parts | |
| JPS52127072A (en) | Wire bonding apparatus | |
| JPS52134395A (en) | Led display device | |
| JPS5377386A (en) | Device for inserting electronic parts automatically | |
| JPS527595A (en) | Apparatus for positioning transweb member for bent outer plate or the like | |
| JPS526470A (en) | Semiconductor integrated circuit |