JPS5329071B2 - - Google Patents
Info
- Publication number
- JPS5329071B2 JPS5329071B2 JP1143672A JP1143672A JPS5329071B2 JP S5329071 B2 JPS5329071 B2 JP S5329071B2 JP 1143672 A JP1143672 A JP 1143672A JP 1143672 A JP1143672 A JP 1143672A JP S5329071 B2 JPS5329071 B2 JP S5329071B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/688—Flexible insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/654—Top-view layouts
- H10W70/655—Fan-out layouts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
- H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7101600.A NL164425C (nl) | 1971-02-05 | 1971-02-05 | Halfgeleiderinrichting voorzien van een koellichaam. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4845174A JPS4845174A (https=) | 1973-06-28 |
| JPS5329071B2 true JPS5329071B2 (https=) | 1978-08-18 |
Family
ID=19812417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1143672A Expired JPS5329071B2 (https=) | 1971-02-05 | 1972-02-02 |
Country Status (9)
| Country | Link |
|---|---|
| JP (1) | JPS5329071B2 (https=) |
| AU (1) | AU466735B2 (https=) |
| CA (1) | CA956731A (https=) |
| CH (1) | CH538194A (https=) |
| DE (1) | DE2202802B2 (https=) |
| FR (1) | FR2124487B1 (https=) |
| GB (1) | GB1375054A (https=) |
| IT (1) | IT947244B (https=) |
| NL (1) | NL164425C (https=) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113389U (https=) * | 1979-02-02 | 1980-08-09 | ||
| JPS58119595A (ja) * | 1982-01-09 | 1983-07-16 | 三菱電機株式会社 | 巻上装置 |
| JPS59116311U (ja) * | 1983-01-21 | 1984-08-06 | 日立金属株式会社 | 羽根付コンベヤチエン |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5412270A (en) * | 1977-06-22 | 1979-01-29 | Nec Corp | Integrated circuit rackage |
| DE2752655A1 (de) * | 1977-09-23 | 1979-06-07 | Blaupunkt Werke Gmbh | Elektronisches bauelement |
| JPS5549513U (https=) * | 1978-09-28 | 1980-03-31 | ||
| DE3029939A1 (de) * | 1980-08-07 | 1982-03-25 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung |
| FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
| GB2124433B (en) * | 1982-07-07 | 1986-05-21 | Int Standard Electric Corp | Electronic component assembly |
| GB2135521A (en) * | 1983-02-16 | 1984-08-30 | Ferranti Plc | Printed circuit boards |
| US4685030A (en) * | 1985-04-29 | 1987-08-04 | Energy Conversion Devices, Inc. | Surface mounted circuits including hybrid circuits, having CVD interconnects, and method of preparing the circuits |
| JPS62189743A (ja) * | 1986-02-14 | 1987-08-19 | Matsushita Electric Works Ltd | 配線回路体 |
| GB8706857D0 (en) * | 1987-03-23 | 1987-04-29 | Bradley International Ltd Alle | Chip carriers |
| US4868349A (en) * | 1988-05-09 | 1989-09-19 | National Semiconductor Corporation | Plastic molded pin-grid-array power package |
| GB2237682A (en) * | 1989-09-28 | 1991-05-08 | Redpoint Limited | Heatsink for semiconductor devices |
| GB2240425B (en) * | 1990-01-20 | 1994-01-12 | Motorola Ltd | Radio transmitter power amplifier with cooling apparatus |
| JPH07109867B2 (ja) * | 1991-04-15 | 1995-11-22 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 半導体チツプの冷却構造 |
| DE102019115500A1 (de) * | 2019-06-07 | 2020-12-10 | OSRAM CONTINENTAL GmbH | Anordnung und Verfahren zur Herstellung einer Anordnung |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3414775A (en) * | 1967-03-03 | 1968-12-03 | Ibm | Heat dissipating module assembly and method |
| FR1564787A (https=) * | 1968-03-04 | 1969-04-25 |
-
1971
- 1971-02-05 NL NL7101600.A patent/NL164425C/xx not_active IP Right Cessation
-
1972
- 1972-01-21 DE DE2202802A patent/DE2202802B2/de not_active Withdrawn
- 1972-01-31 CA CA133,483A patent/CA956731A/en not_active Expired
- 1972-02-02 CH CH153072A patent/CH538194A/de not_active IP Right Cessation
- 1972-02-02 JP JP1143672A patent/JPS5329071B2/ja not_active Expired
- 1972-02-02 GB GB489372A patent/GB1375054A/en not_active Expired
- 1972-02-02 AU AU38538/72A patent/AU466735B2/en not_active Expired
- 1972-02-02 IT IT20146/72A patent/IT947244B/it active
- 1972-02-04 FR FR7203792A patent/FR2124487B1/fr not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55113389U (https=) * | 1979-02-02 | 1980-08-09 | ||
| JPS58119595A (ja) * | 1982-01-09 | 1983-07-16 | 三菱電機株式会社 | 巻上装置 |
| JPS59116311U (ja) * | 1983-01-21 | 1984-08-06 | 日立金属株式会社 | 羽根付コンベヤチエン |
Also Published As
| Publication number | Publication date |
|---|---|
| NL7101600A (https=) | 1972-08-08 |
| JPS4845174A (https=) | 1973-06-28 |
| GB1375054A (https=) | 1974-11-27 |
| DE2202802B2 (de) | 1979-05-10 |
| CA956731A (en) | 1974-10-22 |
| FR2124487A1 (https=) | 1972-09-22 |
| DE2202802A1 (de) | 1972-08-17 |
| NL164425C (nl) | 1980-12-15 |
| FR2124487B1 (https=) | 1975-10-24 |
| AU466735B2 (en) | 1973-08-09 |
| AU3853872A (en) | 1973-08-09 |
| CH538194A (de) | 1973-06-15 |
| NL164425B (nl) | 1980-07-15 |
| IT947244B (it) | 1973-05-21 |