JPS5323572A - Electornic apparatus - Google Patents

Electornic apparatus

Info

Publication number
JPS5323572A
JPS5323572A JP9842476A JP9842476A JPS5323572A JP S5323572 A JPS5323572 A JP S5323572A JP 9842476 A JP9842476 A JP 9842476A JP 9842476 A JP9842476 A JP 9842476A JP S5323572 A JPS5323572 A JP S5323572A
Authority
JP
Japan
Prior art keywords
lead frames
electornic
electronic parts
parts
lapping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9842476A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5651505B2 (enrdf_load_stackoverflow
Inventor
Mitsuo Matsunami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP9842476A priority Critical patent/JPS5323572A/ja
Publication of JPS5323572A publication Critical patent/JPS5323572A/ja
Publication of JPS5651505B2 publication Critical patent/JPS5651505B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP9842476A 1976-08-17 1976-08-17 Electornic apparatus Granted JPS5323572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9842476A JPS5323572A (en) 1976-08-17 1976-08-17 Electornic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9842476A JPS5323572A (en) 1976-08-17 1976-08-17 Electornic apparatus

Publications (2)

Publication Number Publication Date
JPS5323572A true JPS5323572A (en) 1978-03-04
JPS5651505B2 JPS5651505B2 (enrdf_load_stackoverflow) 1981-12-05

Family

ID=14219420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9842476A Granted JPS5323572A (en) 1976-08-17 1976-08-17 Electornic apparatus

Country Status (1)

Country Link
JP (1) JPS5323572A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518043A (en) * 1978-07-24 1980-02-07 Nec Corp Integrated circuit device
WO1996031906A1 (en) * 1995-04-05 1996-10-10 National Semiconductor Corporation Multi-layer lead frame
JP2008300672A (ja) * 2007-05-31 2008-12-11 Sanyo Electric Co Ltd 半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5518043A (en) * 1978-07-24 1980-02-07 Nec Corp Integrated circuit device
WO1996031906A1 (en) * 1995-04-05 1996-10-10 National Semiconductor Corporation Multi-layer lead frame
US5864173A (en) * 1995-04-05 1999-01-26 National Semiconductor Corporation Multi-layer lead frame
US5994768A (en) * 1995-04-05 1999-11-30 National Semiconductor Corporation Multi-layer lead frame
US6087204A (en) * 1995-04-05 2000-07-11 National Semiconductor Corporation Method of making a multi-layer lead frame
JP2008300672A (ja) * 2007-05-31 2008-12-11 Sanyo Electric Co Ltd 半導体装置

Also Published As

Publication number Publication date
JPS5651505B2 (enrdf_load_stackoverflow) 1981-12-05

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