JPS5323272A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5323272A
JPS5323272A JP9699776A JP9699776A JPS5323272A JP S5323272 A JPS5323272 A JP S5323272A JP 9699776 A JP9699776 A JP 9699776A JP 9699776 A JP9699776 A JP 9699776A JP S5323272 A JPS5323272 A JP S5323272A
Authority
JP
Japan
Prior art keywords
semiconductor device
semiconductor
make
alloy wire
thermal distortion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9699776A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5641177B2 (cg-RX-API-DMAC7.html
Inventor
Toshiyuki Hidaka
Kenzo Shima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9699776A priority Critical patent/JPS5323272A/ja
Publication of JPS5323272A publication Critical patent/JPS5323272A/ja
Publication of JPS5641177B2 publication Critical patent/JPS5641177B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP9699776A 1976-08-16 1976-08-16 Semiconductor device Granted JPS5323272A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9699776A JPS5323272A (en) 1976-08-16 1976-08-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9699776A JPS5323272A (en) 1976-08-16 1976-08-16 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5323272A true JPS5323272A (en) 1978-03-03
JPS5641177B2 JPS5641177B2 (cg-RX-API-DMAC7.html) 1981-09-26

Family

ID=14179824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9699776A Granted JPS5323272A (en) 1976-08-16 1976-08-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5323272A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244935A (en) * 1990-02-26 1993-09-14 Nippon Oil And Fats Co., Ltd. Composition of ultraviolet curing antifogging agent and process for forming antifogging coating film
CN109461673A (zh) * 2018-10-16 2019-03-12 黄山市祁门县锦城电器有限公司 一种硅粒子装配模具及其装配方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244935A (en) * 1990-02-26 1993-09-14 Nippon Oil And Fats Co., Ltd. Composition of ultraviolet curing antifogging agent and process for forming antifogging coating film
CN109461673A (zh) * 2018-10-16 2019-03-12 黄山市祁门县锦城电器有限公司 一种硅粒子装配模具及其装配方法

Also Published As

Publication number Publication date
JPS5641177B2 (cg-RX-API-DMAC7.html) 1981-09-26

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