JPS53138286A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS53138286A JPS53138286A JP5259477A JP5259477A JPS53138286A JP S53138286 A JPS53138286 A JP S53138286A JP 5259477 A JP5259477 A JP 5259477A JP 5259477 A JP5259477 A JP 5259477A JP S53138286 A JPS53138286 A JP S53138286A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- manufacture
- semiconductor device
- forming
- compand
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Weting (AREA)
- Photovoltaic Devices (AREA)
Abstract
PURPOSE:To reduce the substrate consumption by forming an etching compound layer different from the substrate onto the semiconductor substrate by injecting ions of one of O, C and N and by separating the substrate with the compand layer as a boundary after forming a device function part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5259477A JPS53138286A (en) | 1977-05-10 | 1977-05-10 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5259477A JPS53138286A (en) | 1977-05-10 | 1977-05-10 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53138286A true JPS53138286A (en) | 1978-12-02 |
Family
ID=12919101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5259477A Pending JPS53138286A (en) | 1977-05-10 | 1977-05-10 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53138286A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4999083A (en) * | 1988-10-02 | 1991-03-12 | Canon Kabushiki Kaisha | Method of etching crystalline material with etchant injection inlet |
-
1977
- 1977-05-10 JP JP5259477A patent/JPS53138286A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4999083A (en) * | 1988-10-02 | 1991-03-12 | Canon Kabushiki Kaisha | Method of etching crystalline material with etchant injection inlet |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20031121 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20040109 |
|
A521 | Written amendment |
Effective date: 20040226 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050412 |