JPS53134759A - Production of copmosite metal powder - Google Patents
Production of copmosite metal powderInfo
- Publication number
- JPS53134759A JPS53134759A JP4854077A JP4854077A JPS53134759A JP S53134759 A JPS53134759 A JP S53134759A JP 4854077 A JP4854077 A JP 4854077A JP 4854077 A JP4854077 A JP 4854077A JP S53134759 A JPS53134759 A JP S53134759A
- Authority
- JP
- Japan
- Prior art keywords
- production
- metal powder
- silver
- copmosite
- metalic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 229910052751 metal Inorganic materials 0.000 title abstract 2
- 239000002184 metal Substances 0.000 title abstract 2
- 239000000843 powder Substances 0.000 title abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 3
- 229910052709 silver Inorganic materials 0.000 abstract 3
- 239000004332 silver Substances 0.000 abstract 3
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 abstract 3
- 238000000034 method Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
- 238000000151 deposition Methods 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- 238000006467 substitution reaction Methods 0.000 abstract 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 abstract 1
Landscapes
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4854077A JPS53134759A (en) | 1977-04-28 | 1977-04-28 | Production of copmosite metal powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4854077A JPS53134759A (en) | 1977-04-28 | 1977-04-28 | Production of copmosite metal powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53134759A true JPS53134759A (en) | 1978-11-24 |
| JPS5759283B2 JPS5759283B2 (ja) | 1982-12-14 |
Family
ID=12806190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4854077A Granted JPS53134759A (en) | 1977-04-28 | 1977-04-28 | Production of copmosite metal powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS53134759A (ja) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4474323A (en) * | 1979-07-03 | 1984-10-02 | International Standard Electric Corporation | Capacitors |
| JP2006161081A (ja) * | 2004-12-03 | 2006-06-22 | Dowa Mining Co Ltd | 銀被覆銅粉およびその製造方法並びに導電ペースト |
| JP2008111175A (ja) * | 2006-10-31 | 2008-05-15 | Fujikura Kasei Co Ltd | 複合金属粉とその製造方法および導電性ペースト |
| WO2009116782A3 (ko) * | 2008-03-18 | 2009-12-23 | 주식회사 잉크테크 | 복합 기능 코팅액 조성물 |
| JP2010500476A (ja) * | 2006-08-07 | 2010-01-07 | インクテック カンパニー リミテッド | 金属積層板の製造方法 |
| USRE45175E1 (en) | 1994-12-09 | 2014-10-07 | Fry's Metals, Inc. | Process for silver plating in printed circuit board manufacture |
| USRE45297E1 (en) | 1996-03-22 | 2014-12-23 | Ronald Redline | Method for enhancing the solderability of a surface |
| US9072203B2 (en) | 1994-12-09 | 2015-06-30 | Enthone Inc. | Solderability enhancement by silver immersion printed circuit board manufacture |
| USRE45842E1 (en) | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
| USRE45881E1 (en) | 1996-03-22 | 2016-02-09 | Ronald Redline | Method for enhancing the solderability of a surface |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017201052A (ja) * | 2016-05-06 | 2017-11-09 | 株式会社村田製作所 | 金属粉末の製造方法 |
-
1977
- 1977-04-28 JP JP4854077A patent/JPS53134759A/ja active Granted
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4474323A (en) * | 1979-07-03 | 1984-10-02 | International Standard Electric Corporation | Capacitors |
| USRE45175E1 (en) | 1994-12-09 | 2014-10-07 | Fry's Metals, Inc. | Process for silver plating in printed circuit board manufacture |
| USRE45279E1 (en) | 1994-12-09 | 2014-12-09 | Fry's Metals, Inc. | Process for silver plating in printed circuit board manufacture |
| US9072203B2 (en) | 1994-12-09 | 2015-06-30 | Enthone Inc. | Solderability enhancement by silver immersion printed circuit board manufacture |
| USRE45297E1 (en) | 1996-03-22 | 2014-12-23 | Ronald Redline | Method for enhancing the solderability of a surface |
| USRE45881E1 (en) | 1996-03-22 | 2016-02-09 | Ronald Redline | Method for enhancing the solderability of a surface |
| USRE45842E1 (en) | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
| JP2006161081A (ja) * | 2004-12-03 | 2006-06-22 | Dowa Mining Co Ltd | 銀被覆銅粉およびその製造方法並びに導電ペースト |
| JP2010500476A (ja) * | 2006-08-07 | 2010-01-07 | インクテック カンパニー リミテッド | 金属積層板の製造方法 |
| US8764960B2 (en) | 2006-08-07 | 2014-07-01 | Inktec Co., Ltd. | Manufacturing methods for metal clad laminates |
| JP2008111175A (ja) * | 2006-10-31 | 2008-05-15 | Fujikura Kasei Co Ltd | 複合金属粉とその製造方法および導電性ペースト |
| WO2009116782A3 (ko) * | 2008-03-18 | 2009-12-23 | 주식회사 잉크테크 | 복합 기능 코팅액 조성물 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5759283B2 (ja) | 1982-12-14 |
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