JPS5759283B2 - - Google Patents
Info
- Publication number
- JPS5759283B2 JPS5759283B2 JP52048540A JP4854077A JPS5759283B2 JP S5759283 B2 JPS5759283 B2 JP S5759283B2 JP 52048540 A JP52048540 A JP 52048540A JP 4854077 A JP4854077 A JP 4854077A JP S5759283 B2 JPS5759283 B2 JP S5759283B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Powder Metallurgy (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4854077A JPS53134759A (en) | 1977-04-28 | 1977-04-28 | Production of copmosite metal powder |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4854077A JPS53134759A (en) | 1977-04-28 | 1977-04-28 | Production of copmosite metal powder |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS53134759A JPS53134759A (en) | 1978-11-24 |
JPS5759283B2 true JPS5759283B2 (ja) | 1982-12-14 |
Family
ID=12806190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4854077A Granted JPS53134759A (en) | 1977-04-28 | 1977-04-28 | Production of copmosite metal powder |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53134759A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017201052A (ja) * | 2016-05-06 | 2017-11-09 | 株式会社村田製作所 | 金属粉末の製造方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2053058B (en) * | 1979-07-03 | 1983-02-09 | Standard Telephones Cables Ltd | Soldered electrical connection for a capacitor |
GB9425030D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Silver plating |
GB9425031D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
US6905587B2 (en) | 1996-03-22 | 2005-06-14 | Ronald Redline | Method for enhancing the solderability of a surface |
US6544397B2 (en) | 1996-03-22 | 2003-04-08 | Ronald Redline | Method for enhancing the solderability of a surface |
USRE45842E1 (en) | 1999-02-17 | 2016-01-12 | Ronald Redline | Method for enhancing the solderability of a surface |
JP4660701B2 (ja) * | 2004-12-03 | 2011-03-30 | Dowaエレクトロニクス株式会社 | 銀被覆銅粉およびその製造方法並びに導電ペースト |
EP2066497B1 (en) | 2006-08-07 | 2018-11-07 | Inktec Co., Ltd. | Manufacturing methods for metal clad laminates |
JP2008111175A (ja) * | 2006-10-31 | 2008-05-15 | Fujikura Kasei Co Ltd | 複合金属粉とその製造方法および導電性ペースト |
KR101675493B1 (ko) * | 2008-03-18 | 2016-11-14 | 주식회사 잉크테크 | 복합 기능 코팅액 조성물 |
-
1977
- 1977-04-28 JP JP4854077A patent/JPS53134759A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017201052A (ja) * | 2016-05-06 | 2017-11-09 | 株式会社村田製作所 | 金属粉末の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS53134759A (en) | 1978-11-24 |