JPS53110468A - Metal mould for semiconductor device - Google Patents

Metal mould for semiconductor device

Info

Publication number
JPS53110468A
JPS53110468A JP2620177A JP2620177A JPS53110468A JP S53110468 A JPS53110468 A JP S53110468A JP 2620177 A JP2620177 A JP 2620177A JP 2620177 A JP2620177 A JP 2620177A JP S53110468 A JPS53110468 A JP S53110468A
Authority
JP
Japan
Prior art keywords
metal mould
semiconductor device
depth
mould
circumference
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2620177A
Other languages
English (en)
Japanese (ja)
Other versions
JPS618575B2 (enrdf_load_stackoverflow
Inventor
Manabu Bonshihara
Toshinori Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2620177A priority Critical patent/JPS53110468A/ja
Publication of JPS53110468A publication Critical patent/JPS53110468A/ja
Publication of JPS618575B2 publication Critical patent/JPS618575B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2620177A 1977-03-09 1977-03-09 Metal mould for semiconductor device Granted JPS53110468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2620177A JPS53110468A (en) 1977-03-09 1977-03-09 Metal mould for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2620177A JPS53110468A (en) 1977-03-09 1977-03-09 Metal mould for semiconductor device

Publications (2)

Publication Number Publication Date
JPS53110468A true JPS53110468A (en) 1978-09-27
JPS618575B2 JPS618575B2 (enrdf_load_stackoverflow) 1986-03-15

Family

ID=12186850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2620177A Granted JPS53110468A (en) 1977-03-09 1977-03-09 Metal mould for semiconductor device

Country Status (1)

Country Link
JP (1) JPS53110468A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01281739A (ja) * 1988-05-07 1989-11-13 Mitsubishi Electric Corp モールド金型

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8618905U1 (de) * 1986-07-15 1986-08-28 fischerwerke Artur Fischer GmbH & Co KG, 7244 Tumlingen Aufbewahrungsbehälter für Magnetbandkassetten
JPS6371741U (enrdf_load_stackoverflow) * 1986-10-27 1988-05-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01281739A (ja) * 1988-05-07 1989-11-13 Mitsubishi Electric Corp モールド金型

Also Published As

Publication number Publication date
JPS618575B2 (enrdf_load_stackoverflow) 1986-03-15

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