JPS5311037A - Thin film thermal head - Google Patents
Thin film thermal headInfo
- Publication number
- JPS5311037A JPS5311037A JP8500876A JP8500876A JPS5311037A JP S5311037 A JPS5311037 A JP S5311037A JP 8500876 A JP8500876 A JP 8500876A JP 8500876 A JP8500876 A JP 8500876A JP S5311037 A JPS5311037 A JP S5311037A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- thermal head
- film thermal
- resistivity
- wanted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010409 thin film Substances 0.000 title 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
- H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electronic Switches (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8500876A JPS5311037A (en) | 1976-07-19 | 1976-07-19 | Thin film thermal head |
| US05/816,144 US4105892A (en) | 1976-07-19 | 1977-07-15 | Thin resistor film type thermal head for printing on heat-sensitive paper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8500876A JPS5311037A (en) | 1976-07-19 | 1976-07-19 | Thin film thermal head |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9397180A Division JPS56150575A (en) | 1980-07-11 | 1980-07-11 | Production of thin film thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5311037A true JPS5311037A (en) | 1978-02-01 |
| JPS5637071B2 JPS5637071B2 (enExample) | 1981-08-28 |
Family
ID=13846706
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8500876A Granted JPS5311037A (en) | 1976-07-19 | 1976-07-19 | Thin film thermal head |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4105892A (enExample) |
| JP (1) | JPS5311037A (enExample) |
Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122728U (enExample) * | 1978-02-15 | 1979-08-28 | ||
| JPS55117671A (en) * | 1979-03-02 | 1980-09-10 | Hitachi Ltd | Thermal printing head |
| JPS5761582A (en) * | 1980-10-01 | 1982-04-14 | Toshiba Corp | Thermal printing head method of manufacutre thereof |
| JPS5762729U (enExample) * | 1980-09-26 | 1982-04-14 | ||
| JPS5761581A (en) * | 1980-10-01 | 1982-04-14 | Toshiba Corp | Method of manufacture of thermal printing head |
| JPS57178878A (en) * | 1981-04-30 | 1982-11-04 | Toshiba Corp | Thin film heat sensitive print head |
| JPS59169872A (ja) * | 1983-03-17 | 1984-09-25 | Mitsubishi Electric Corp | サ−マルヘツド及びその製造方法 |
| JPS61131515A (ja) * | 1984-11-30 | 1986-06-19 | 株式会社東芝 | サ−マルヘツドの製造方法 |
| JPS61172303A (ja) * | 1985-12-26 | 1986-08-04 | 株式会社東芝 | 薄膜抵抗用スパツタリング焼結体ターゲツト |
| JPS62167056A (ja) * | 1986-01-20 | 1987-07-23 | Kyocera Corp | サ−マルヘツド |
| JPS62202756A (ja) * | 1986-03-03 | 1987-09-07 | Tdk Corp | 薄膜型サ−マルヘツド |
| JPS62202755A (ja) * | 1986-03-03 | 1987-09-07 | Tdk Corp | 薄膜型サ−マルヘツド |
| JPS62202754A (ja) * | 1986-03-03 | 1987-09-07 | Tdk Corp | 薄膜型サ−マルヘツド |
| JPS6455253A (en) * | 1987-08-26 | 1989-03-02 | Hitachi Ltd | Thermal head |
| DE4317944A1 (de) * | 1992-05-29 | 1993-12-09 | Hitachi Koki Kk | Tintenstrahl-Bildaufzeichnungsgerät |
| US5831648A (en) * | 1992-05-29 | 1998-11-03 | Hitachi Koki Co., Ltd. | Ink jet recording head |
| US5966153A (en) * | 1995-12-27 | 1999-10-12 | Hitachi Koki Co., Ltd. | Ink jet printing device |
| US6547372B1 (en) | 2001-07-27 | 2003-04-15 | Kyocera Corporation | Ink jet head |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4169032A (en) * | 1978-05-24 | 1979-09-25 | International Business Machines Corporation | Method of making a thin film thermal print head |
| US4396687A (en) * | 1980-12-08 | 1983-08-02 | Ford Motor Company | Chemically regenerable redox fuel cell and method of operating the same |
| US4407902A (en) * | 1980-12-08 | 1983-10-04 | Ford Motor Company | Chemically regenerable redox fuel cell and method of operating the same |
| US4523235A (en) * | 1982-01-11 | 1985-06-11 | Jan Rajchman | Electronic microcopier apparatus |
| US4558331A (en) * | 1984-05-07 | 1985-12-10 | Honeywell Inc. | Heating resistor shape in a thermal printhead |
| JPS61159701A (ja) * | 1984-12-28 | 1986-07-19 | 株式会社東芝 | サ−マルヘツドおよびその製造方法 |
| JPS61181101A (ja) * | 1985-02-07 | 1986-08-13 | アルプス電気株式会社 | サ−マルヘツドおよびその製造方法 |
| EP0211331A3 (en) * | 1985-08-02 | 1989-10-25 | Hitachi, Ltd. | Heat-sensitive recording head and method of manufacturing same |
| DE3810667A1 (de) * | 1988-03-29 | 1989-10-19 | Siemens Ag | Elektrisches widerstandsmaterial fuer elektrothermische wandler in duennschichttechnik |
| EP0630749B1 (en) * | 1993-06-28 | 1998-12-23 | Canon Kabushiki Kaisha | Heat generating resistor containing TaN0.8, substrate provided with said heat generating resistor for liquid jet head, liquid jet head provided with said substrate, and liquid jet apparatus provided with said liquid jet head |
| DE69723372T2 (de) * | 1996-08-22 | 2004-07-01 | Canon K.K. | Tintenstrahlkopfsubstrat, Verfahren zum Herstellen des Substrats, Tintenstrahlaufzeichnungskopf mit dem Substrat und Verfahren zur Herstellung des Kopfes |
| US6527813B1 (en) | 1996-08-22 | 2003-03-04 | Canon Kabushiki Kaisha | Ink jet head substrate, an ink jet head, an ink jet apparatus, and a method for manufacturing an ink jet recording head |
| US6299294B1 (en) * | 1999-07-29 | 2001-10-09 | Hewlett-Packard Company | High efficiency printhead containing a novel oxynitride-based resistor system |
| JP3935687B2 (ja) * | 2001-06-20 | 2007-06-27 | アルプス電気株式会社 | 薄膜抵抗素子およびその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52109947A (en) * | 1976-03-11 | 1977-09-14 | Matsushita Electric Ind Co Ltd | Thermal head and its preparation |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3518406A (en) * | 1967-06-19 | 1970-06-30 | Ncr Co | Thermal half-select printing matrix |
-
1976
- 1976-07-19 JP JP8500876A patent/JPS5311037A/ja active Granted
-
1977
- 1977-07-15 US US05/816,144 patent/US4105892A/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52109947A (en) * | 1976-03-11 | 1977-09-14 | Matsushita Electric Ind Co Ltd | Thermal head and its preparation |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54122728U (enExample) * | 1978-02-15 | 1979-08-28 | ||
| JPS55117671A (en) * | 1979-03-02 | 1980-09-10 | Hitachi Ltd | Thermal printing head |
| JPS5762729U (enExample) * | 1980-09-26 | 1982-04-14 | ||
| JPS5761582A (en) * | 1980-10-01 | 1982-04-14 | Toshiba Corp | Thermal printing head method of manufacutre thereof |
| JPS5761581A (en) * | 1980-10-01 | 1982-04-14 | Toshiba Corp | Method of manufacture of thermal printing head |
| JPS57178878A (en) * | 1981-04-30 | 1982-11-04 | Toshiba Corp | Thin film heat sensitive print head |
| JPS59169872A (ja) * | 1983-03-17 | 1984-09-25 | Mitsubishi Electric Corp | サ−マルヘツド及びその製造方法 |
| JPS61131515A (ja) * | 1984-11-30 | 1986-06-19 | 株式会社東芝 | サ−マルヘツドの製造方法 |
| JPS61172303A (ja) * | 1985-12-26 | 1986-08-04 | 株式会社東芝 | 薄膜抵抗用スパツタリング焼結体ターゲツト |
| JPS62167056A (ja) * | 1986-01-20 | 1987-07-23 | Kyocera Corp | サ−マルヘツド |
| JPS62202756A (ja) * | 1986-03-03 | 1987-09-07 | Tdk Corp | 薄膜型サ−マルヘツド |
| JPS62202755A (ja) * | 1986-03-03 | 1987-09-07 | Tdk Corp | 薄膜型サ−マルヘツド |
| JPS62202754A (ja) * | 1986-03-03 | 1987-09-07 | Tdk Corp | 薄膜型サ−マルヘツド |
| JPS6455253A (en) * | 1987-08-26 | 1989-03-02 | Hitachi Ltd | Thermal head |
| DE4317944A1 (de) * | 1992-05-29 | 1993-12-09 | Hitachi Koki Kk | Tintenstrahl-Bildaufzeichnungsgerät |
| US5710583A (en) * | 1992-05-29 | 1998-01-20 | Hitachi Koki Co., Ltd. | Ink jet image recorder |
| US5831648A (en) * | 1992-05-29 | 1998-11-03 | Hitachi Koki Co., Ltd. | Ink jet recording head |
| US5966153A (en) * | 1995-12-27 | 1999-10-12 | Hitachi Koki Co., Ltd. | Ink jet printing device |
| US6547372B1 (en) | 2001-07-27 | 2003-04-15 | Kyocera Corporation | Ink jet head |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5637071B2 (enExample) | 1981-08-28 |
| US4105892A (en) | 1978-08-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5311037A (en) | Thin film thermal head | |
| JPS53149041A (en) | Production of thermal head of thick type | |
| JPS52109947A (en) | Thermal head and its preparation | |
| JPS529160A (en) | Heat conductive wall | |
| JPS5538746A (en) | Temperature compensating method for intermediate tone recording | |
| JPS52151888A (en) | Heat sensing material | |
| JPS5356042A (en) | Thermal head | |
| JPS5312337A (en) | Thermal head of thin film type | |
| JPS5227375A (en) | Cooling equipment of electrical parts | |
| JPS5395580A (en) | Semiconductor device | |
| JPS5354978A (en) | Insulated gate type field effect element | |
| JPS5393845A (en) | Thermal heads manufacture | |
| JPS53101426A (en) | Thin film type thermal head | |
| JPS52149587A (en) | Addition rate control method of uniform density paste | |
| JPS51150095A (en) | Thin film resistor | |
| JPS5337405A (en) | Thin film magnetic head and its manufacture | |
| JPS52112333A (en) | Thermal recording head | |
| JPS5350500A (en) | Mica lamination | |
| JPS5350241A (en) | Electrodeposit coating | |
| JPS5262287A (en) | Preparation of dihydrobenzofuran derivatives | |
| JPS51114320A (en) | Alloy for nesister | |
| JPS5335997A (en) | Thin film resistor material | |
| JPS53113554A (en) | Thin film type thermal head | |
| JPS5368897A (en) | Oxide dielectric material | |
| JPS53136480A (en) | Brazing method |