JPS53108783A - Production of semiconductor device - Google Patents
Production of semiconductor deviceInfo
- Publication number
- JPS53108783A JPS53108783A JP2357177A JP2357177A JPS53108783A JP S53108783 A JPS53108783 A JP S53108783A JP 2357177 A JP2357177 A JP 2357177A JP 2357177 A JP2357177 A JP 2357177A JP S53108783 A JPS53108783 A JP S53108783A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- production
- semiconductor device
- forming
- diffused layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0214—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L
- H01L27/0229—Particular design considerations for integrated circuits for internal polarisation, e.g. I2L of bipolar structures
- H01L27/0233—Integrated injection logic structures [I2L]
- H01L27/0244—I2L structures integrated in combination with analog structures
Abstract
PURPOSE:To make possible parallel provision of both high-speed and high-dielectric strength elements within the same chip by forming a first impurity diffused layer from a first semiconductor layer surface down to the substrate, covering said layer with a second semiconductor layer, and providing element isolating regions in the second step process of forming a second impurity diffused layer from the surface thereof down to the first diffused layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2357177A JPS53108783A (en) | 1977-03-04 | 1977-03-04 | Production of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2357177A JPS53108783A (en) | 1977-03-04 | 1977-03-04 | Production of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53108783A true JPS53108783A (en) | 1978-09-21 |
Family
ID=12114217
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2357177A Pending JPS53108783A (en) | 1977-03-04 | 1977-03-04 | Production of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53108783A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5527697A (en) * | 1978-08-11 | 1980-02-27 | Siemens Ag | Bipolar semiconductor integrated circuit and method of manufacturing same |
-
1977
- 1977-03-04 JP JP2357177A patent/JPS53108783A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5527697A (en) * | 1978-08-11 | 1980-02-27 | Siemens Ag | Bipolar semiconductor integrated circuit and method of manufacturing same |
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