JPS5271987A - Semiconductor substrate provided with beam lead type semiconductor dev ices - Google Patents
Semiconductor substrate provided with beam lead type semiconductor dev icesInfo
- Publication number
- JPS5271987A JPS5271987A JP14797475A JP14797475A JPS5271987A JP S5271987 A JPS5271987 A JP S5271987A JP 14797475 A JP14797475 A JP 14797475A JP 14797475 A JP14797475 A JP 14797475A JP S5271987 A JPS5271987 A JP S5271987A
- Authority
- JP
- Japan
- Prior art keywords
- substrate provided
- beam lead
- lead type
- semiconductor substrate
- type semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE: To release wiring density within the main device by extending beam leads to isolating regions between beam lead devices and composing check elements.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14797475A JPS5271987A (en) | 1975-12-11 | 1975-12-11 | Semiconductor substrate provided with beam lead type semiconductor dev ices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14797475A JPS5271987A (en) | 1975-12-11 | 1975-12-11 | Semiconductor substrate provided with beam lead type semiconductor dev ices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5271987A true JPS5271987A (en) | 1977-06-15 |
JPS542545B2 JPS542545B2 (en) | 1979-02-08 |
Family
ID=15442299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14797475A Granted JPS5271987A (en) | 1975-12-11 | 1975-12-11 | Semiconductor substrate provided with beam lead type semiconductor dev ices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5271987A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55175243U (en) * | 1979-06-01 | 1980-12-16 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3849872A (en) * | 1972-10-24 | 1974-11-26 | Ibm | Contacting integrated circuit chip terminal through the wafer kerf |
-
1975
- 1975-12-11 JP JP14797475A patent/JPS5271987A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3849872A (en) * | 1972-10-24 | 1974-11-26 | Ibm | Contacting integrated circuit chip terminal through the wafer kerf |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55175243U (en) * | 1979-06-01 | 1980-12-16 |
Also Published As
Publication number | Publication date |
---|---|
JPS542545B2 (en) | 1979-02-08 |
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