JPS5271983A - Resin seal type semiconductor device - Google Patents

Resin seal type semiconductor device

Info

Publication number
JPS5271983A
JPS5271983A JP14797675A JP14797675A JPS5271983A JP S5271983 A JPS5271983 A JP S5271983A JP 14797675 A JP14797675 A JP 14797675A JP 14797675 A JP14797675 A JP 14797675A JP S5271983 A JPS5271983 A JP S5271983A
Authority
JP
Japan
Prior art keywords
semiconductor device
type semiconductor
seal type
resin seal
base alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14797675A
Other languages
Japanese (ja)
Other versions
JPS60780B2 (en
Inventor
Akinori Numata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP14797675A priority Critical patent/JPS60780B2/en
Publication of JPS5271983A publication Critical patent/JPS5271983A/en
Publication of JPS60780B2 publication Critical patent/JPS60780B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain an inexpensive resin seal type semiconductor device of good radiation effect by producing a semiconductor bonding piece using Cu or Cu-base alloy and the entire part using Fe or Fe-base alloy.
JP14797675A 1975-12-11 1975-12-11 semiconductor equipment Expired JPS60780B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14797675A JPS60780B2 (en) 1975-12-11 1975-12-11 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14797675A JPS60780B2 (en) 1975-12-11 1975-12-11 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5271983A true JPS5271983A (en) 1977-06-15
JPS60780B2 JPS60780B2 (en) 1985-01-10

Family

ID=15442347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14797675A Expired JPS60780B2 (en) 1975-12-11 1975-12-11 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS60780B2 (en)

Also Published As

Publication number Publication date
JPS60780B2 (en) 1985-01-10

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