JPS5256866A - Resin seal of semiconductor device - Google Patents
Resin seal of semiconductor deviceInfo
- Publication number
- JPS5256866A JPS5256866A JP13253875A JP13253875A JPS5256866A JP S5256866 A JPS5256866 A JP S5256866A JP 13253875 A JP13253875 A JP 13253875A JP 13253875 A JP13253875 A JP 13253875A JP S5256866 A JPS5256866 A JP S5256866A
- Authority
- JP
- Japan
- Prior art keywords
- resin seal
- semiconductor device
- resion
- coat
- simplify
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To simplify and improve efficiency of work after resin seal by forming connection piece of resion coat and connecting piece during the formation of resion coat on the main part of metallic wire.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13253875A JPS5256866A (en) | 1975-11-05 | 1975-11-05 | Resin seal of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13253875A JPS5256866A (en) | 1975-11-05 | 1975-11-05 | Resin seal of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5256866A true JPS5256866A (en) | 1977-05-10 |
Family
ID=15083608
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13253875A Pending JPS5256866A (en) | 1975-11-05 | 1975-11-05 | Resin seal of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5256866A (en) |
-
1975
- 1975-11-05 JP JP13253875A patent/JPS5256866A/en active Pending
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