JPS5244162A - Method of processing semiconductor wafer - Google Patents

Method of processing semiconductor wafer

Info

Publication number
JPS5244162A
JPS5244162A JP11938375A JP11938375A JPS5244162A JP S5244162 A JPS5244162 A JP S5244162A JP 11938375 A JP11938375 A JP 11938375A JP 11938375 A JP11938375 A JP 11938375A JP S5244162 A JPS5244162 A JP S5244162A
Authority
JP
Japan
Prior art keywords
wafer
semiconductor wafer
processing semiconductor
rotatively
grind
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11938375A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5343007B2 (OSRAM
Inventor
Nobuyuki Akiyama
Kouji Kuwabara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Techxiv Corp
Original Assignee
Komatsu Electronic Metals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Electronic Metals Co Ltd filed Critical Komatsu Electronic Metals Co Ltd
Priority to JP11938375A priority Critical patent/JPS5244162A/ja
Publication of JPS5244162A publication Critical patent/JPS5244162A/ja
Publication of JPS5343007B2 publication Critical patent/JPS5343007B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP11938375A 1975-10-04 1975-10-04 Method of processing semiconductor wafer Granted JPS5244162A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11938375A JPS5244162A (en) 1975-10-04 1975-10-04 Method of processing semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11938375A JPS5244162A (en) 1975-10-04 1975-10-04 Method of processing semiconductor wafer

Publications (2)

Publication Number Publication Date
JPS5244162A true JPS5244162A (en) 1977-04-06
JPS5343007B2 JPS5343007B2 (OSRAM) 1978-11-16

Family

ID=14760140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11938375A Granted JPS5244162A (en) 1975-10-04 1975-10-04 Method of processing semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS5244162A (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424571A (en) * 1977-07-25 1979-02-23 Nec Corp Manufacture for semiconductor wafer
JPH02159722A (ja) * 1988-12-14 1990-06-19 Shin Etsu Handotai Co Ltd ウエーハ研磨装置
US6722964B2 (en) 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424571A (en) * 1977-07-25 1979-02-23 Nec Corp Manufacture for semiconductor wafer
JPH02159722A (ja) * 1988-12-14 1990-06-19 Shin Etsu Handotai Co Ltd ウエーハ研磨装置
US6722964B2 (en) 2000-04-04 2004-04-20 Ebara Corporation Polishing apparatus and method
US6935932B2 (en) 2000-04-04 2005-08-30 Ebara Corporation Polishing apparatus and method
US7108589B2 (en) 2000-04-04 2006-09-19 Ebara Corporation Polishing apparatus and method

Also Published As

Publication number Publication date
JPS5343007B2 (OSRAM) 1978-11-16

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