JPS5237769A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5237769A
JPS5237769A JP50113270A JP11327075A JPS5237769A JP S5237769 A JPS5237769 A JP S5237769A JP 50113270 A JP50113270 A JP 50113270A JP 11327075 A JP11327075 A JP 11327075A JP S5237769 A JPS5237769 A JP S5237769A
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor device
thermoformed
packaged
productivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50113270A
Other languages
English (en)
Japanese (ja)
Other versions
JPS555854B2 (enExample
Inventor
Takichi Ishii
Yasumasa Ide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP50113270A priority Critical patent/JPS5237769A/ja
Publication of JPS5237769A publication Critical patent/JPS5237769A/ja
Publication of JPS555854B2 publication Critical patent/JPS555854B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP50113270A 1975-09-19 1975-09-19 Semiconductor device Granted JPS5237769A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50113270A JPS5237769A (en) 1975-09-19 1975-09-19 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50113270A JPS5237769A (en) 1975-09-19 1975-09-19 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS5237769A true JPS5237769A (en) 1977-03-23
JPS555854B2 JPS555854B2 (enExample) 1980-02-12

Family

ID=14607903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50113270A Granted JPS5237769A (en) 1975-09-19 1975-09-19 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5237769A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56106293A (en) * 1980-05-31 1981-08-24 Nippon Musical Instruments Mfg Cord generator for electronic musical instrument
US4907061A (en) * 1986-10-08 1990-03-06 Mitsubishi Denki Kabushiki Kaisha Electronic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5081476A (enExample) * 1973-11-19 1975-07-02

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5081476A (enExample) * 1973-11-19 1975-07-02

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56106293A (en) * 1980-05-31 1981-08-24 Nippon Musical Instruments Mfg Cord generator for electronic musical instrument
US4907061A (en) * 1986-10-08 1990-03-06 Mitsubishi Denki Kabushiki Kaisha Electronic device

Also Published As

Publication number Publication date
JPS555854B2 (enExample) 1980-02-12

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