JPS523195A - Conductor composition - Google Patents

Conductor composition

Info

Publication number
JPS523195A
JPS523195A JP50117767A JP11776775A JPS523195A JP S523195 A JPS523195 A JP S523195A JP 50117767 A JP50117767 A JP 50117767A JP 11776775 A JP11776775 A JP 11776775A JP S523195 A JPS523195 A JP S523195A
Authority
JP
Japan
Prior art keywords
conductor composition
conductor
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50117767A
Other languages
English (en)
Other versions
JPS5619043B2 (ja
Inventor
Chiyaaruzu Hofuman Ruisu
Uiriamu Makuman Chiyaaruzu
Haabii Monesu Aasaa
Aruton Shiyooto Oribaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JPS523195A publication Critical patent/JPS523195A/ja
Publication of JPS5619043B2 publication Critical patent/JPS5619043B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5183—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP50117767A 1975-06-23 1975-10-01 Conductor composition Granted JPS523195A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/588,131 US3970590A (en) 1975-06-23 1975-06-23 Gold conductor compositions

Publications (2)

Publication Number Publication Date
JPS523195A true JPS523195A (en) 1977-01-11
JPS5619043B2 JPS5619043B2 (ja) 1981-05-02

Family

ID=24352610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50117767A Granted JPS523195A (en) 1975-06-23 1975-10-01 Conductor composition

Country Status (3)

Country Link
US (1) US3970590A (ja)
JP (1) JPS523195A (ja)
CA (1) CA1042235A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164877A (en) * 1980-05-23 1981-12-18 Fujitsu Ltd Manufacture of head for thermal printer
JPS5871293A (ja) * 1981-10-23 1983-04-27 Nippon Komu Kk 懸濁液輸送船

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4070518A (en) * 1976-10-15 1978-01-24 E. I. Du Pont De Nemours And Company Copper metallizations
US4101710A (en) * 1977-03-07 1978-07-18 E. I. Du Pont De Nemours And Company Silver compositions
US4295271A (en) * 1978-09-15 1981-10-20 Honeywell Information Systems Inc. Method of soldering a lead to a sintered lead pad
US4354311A (en) * 1978-09-15 1982-10-19 Honeywell Information Systems Inc. Solderable conductor composition and a method of soldering a lead to a lead pad
US4466830A (en) * 1982-11-19 1984-08-21 E. I. Du Pont De Nemours And Company Thick film gold metallization composition
US4547436A (en) * 1982-11-19 1985-10-15 E. I. Du Pont De Nemours And Company Conductive element metallized with a thick film gold composition
US5422190A (en) * 1993-01-22 1995-06-06 Ferro Corporation Via fill paste and method of using the same containing specific amounts of silver, gold and refractory oxides
US5955686A (en) * 1996-10-30 1999-09-21 Dowa Mining Co., Ltd. Brazing materials for producing metal-ceramics composite substrates
CN102356434A (zh) * 2009-03-19 2012-02-15 E.I.内穆尔杜邦公司 用于太阳能电池电极的导体浆料

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3350341A (en) * 1964-07-16 1967-10-31 Du Pont Silver compositions containing novel vitreous binders and a vehicle
JPS4985116A (ja) * 1972-03-08 1974-08-15

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3385799A (en) * 1965-11-09 1968-05-28 Du Pont Metalizing compositions
GB1356577A (en) * 1970-08-27 1974-06-12 Atomic Energy Authority Uk Metalizing pastes
US3827891A (en) * 1970-12-17 1974-08-06 J Larry High adhesion metallizing compositions
US3799890A (en) * 1972-03-08 1974-03-26 B Smith Composition and method of bonding gold to a ceramic substrate and a bonded gold article
US3799891A (en) * 1972-04-27 1974-03-26 B Smith Gold composition for bonding gold to a ceramic substrate utilizing copper oxide and cadmium oxide
US3935366A (en) * 1972-04-27 1976-01-27 Electro Oxide Corporation Bonded gold article composition for bonding gold to a ceramic substrate utilizing copper oxide and cadium oxide

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3350341A (en) * 1964-07-16 1967-10-31 Du Pont Silver compositions containing novel vitreous binders and a vehicle
JPS4985116A (ja) * 1972-03-08 1974-08-15

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164877A (en) * 1980-05-23 1981-12-18 Fujitsu Ltd Manufacture of head for thermal printer
JPS5871293A (ja) * 1981-10-23 1983-04-27 Nippon Komu Kk 懸濁液輸送船
JPS6366715B2 (ja) * 1981-10-23 1988-12-21 Nippon Komusen Kk

Also Published As

Publication number Publication date
JPS5619043B2 (ja) 1981-05-02
CA1042235A (en) 1978-11-14
DE2543922A1 (de) 1976-12-30
US3970590A (en) 1976-07-20
DE2543922B2 (de) 1977-06-30

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