JPS5230164A - Method for fabrication of lead frame - Google Patents

Method for fabrication of lead frame

Info

Publication number
JPS5230164A
JPS5230164A JP10616675A JP10616675A JPS5230164A JP S5230164 A JPS5230164 A JP S5230164A JP 10616675 A JP10616675 A JP 10616675A JP 10616675 A JP10616675 A JP 10616675A JP S5230164 A JPS5230164 A JP S5230164A
Authority
JP
Japan
Prior art keywords
lead frame
fabrication
sealed
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10616675A
Other languages
Japanese (ja)
Inventor
Hiroaki Shimizu
Yoshiaki Tatsumi
Takatoshi Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10616675A priority Critical patent/JPS5230164A/en
Publication of JPS5230164A publication Critical patent/JPS5230164A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve electric contact of lead frame, which is formed by combining mechanically materials used in resin-sealed, semiconductor device, etc.
JP10616675A 1975-09-02 1975-09-02 Method for fabrication of lead frame Pending JPS5230164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10616675A JPS5230164A (en) 1975-09-02 1975-09-02 Method for fabrication of lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10616675A JPS5230164A (en) 1975-09-02 1975-09-02 Method for fabrication of lead frame

Publications (1)

Publication Number Publication Date
JPS5230164A true JPS5230164A (en) 1977-03-07

Family

ID=14426682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10616675A Pending JPS5230164A (en) 1975-09-02 1975-09-02 Method for fabrication of lead frame

Country Status (1)

Country Link
JP (1) JPS5230164A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186045U (en) * 1981-05-20 1982-11-26

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57186045U (en) * 1981-05-20 1982-11-26

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