JPS5228547B2 - - Google Patents
Info
- Publication number
- JPS5228547B2 JPS5228547B2 JP47114643A JP11464372A JPS5228547B2 JP S5228547 B2 JPS5228547 B2 JP S5228547B2 JP 47114643 A JP47114643 A JP 47114643A JP 11464372 A JP11464372 A JP 11464372A JP S5228547 B2 JPS5228547 B2 JP S5228547B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H10W40/22—
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- H10W70/635—
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- H10W72/075—
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- H10W76/157—
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- H10W70/682—
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- H10W72/073—
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- H10W72/5445—
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- H10W72/5449—
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- H10W72/5475—
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- H10W72/884—
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- H10W72/926—
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- H10W72/932—
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- H10W90/754—
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27044872A | 1972-07-10 | 1972-07-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4938575A JPS4938575A (en:Method) | 1974-04-10 |
| JPS5228547B2 true JPS5228547B2 (en:Method) | 1977-07-27 |
Family
ID=23031361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47114643A Expired JPS5228547B2 (en:Method) | 1972-07-10 | 1972-11-14 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US4115837A (en:Method) |
| JP (1) | JPS5228547B2 (en:Method) |
| AT (1) | AT356713B (en:Method) |
| BR (1) | BR7305010D0 (en:Method) |
| ES (1) | ES417197A1 (en:Method) |
| IT (1) | IT991087B (en:Method) |
| NO (1) | NO143441C (en:Method) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5433830Y2 (en:Method) * | 1974-05-31 | 1979-10-17 | ||
| JPS5213772A (en) * | 1975-07-22 | 1977-02-02 | Kyocera Corp | Ic package |
| JPS5236472A (en) * | 1975-09-17 | 1977-03-19 | Mitsubishi Electric Corp | Semiconductor unit |
| JPS5471572A (en) * | 1977-11-18 | 1979-06-08 | Fujitsu Ltd | Semiconductor device |
| EP0016522B1 (en) * | 1979-02-19 | 1982-12-22 | Fujitsu Limited | Semiconductor device and method for manufacturing the same |
| US4278990A (en) * | 1979-03-19 | 1981-07-14 | General Electric Company | Low thermal resistance, low stress semiconductor package |
| US4288841A (en) * | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
| WO1981003734A1 (en) * | 1980-06-19 | 1981-12-24 | Digital Equipment Corp | Heat pin integrated circuit packaging |
| JPS59139652A (ja) * | 1983-12-02 | 1984-08-10 | Hitachi Ltd | 電子回路装置の実装構造 |
| US4633371A (en) * | 1984-09-17 | 1986-12-30 | Amdahl Corporation | Heat pipe heat exchanger for large scale integrated circuits |
| EP0180906B1 (de) * | 1984-11-02 | 1989-01-18 | Siemens Aktiengesellschaft | Wellenwiderstandsgetreuer Chipträger für Mikrowellenhalbleiter |
| US4916515A (en) * | 1985-06-03 | 1990-04-10 | Levi Clifford A | Microwave circuit integrating |
| JPS63181399A (ja) * | 1987-01-22 | 1988-07-26 | 日本特殊陶業株式会社 | 高熱伝導性厚膜多層配線基板 |
| US5008734A (en) * | 1989-12-20 | 1991-04-16 | National Semiconductor Corporation | Stadium-stepped package for an integrated circuit with air dielectric |
| US5159750A (en) * | 1989-12-20 | 1992-11-03 | National Semiconductor Corporation | Method of connecting an IC component with another electrical component |
| EP0435155B1 (en) * | 1989-12-29 | 1994-06-01 | Sumitomo Electric Industries, Ltd. | Radiating fin having improved life and thermal conductivity |
| JPH04164361A (ja) * | 1990-10-29 | 1992-06-10 | Nec Corp | 樹脂封止型半導体装置 |
| US5325268A (en) * | 1993-01-28 | 1994-06-28 | National Semiconductor Corporation | Interconnector for a multi-chip module or package |
| EP1805809B1 (en) * | 2004-10-22 | 2019-10-09 | Signify Holding B.V. | Semiconductor light emitting device with improved heatsinking |
| US20130187286A1 (en) * | 2011-07-25 | 2013-07-25 | Richard Schneider | Lead frameless hermetic circuit package |
| US10374387B2 (en) * | 2017-11-10 | 2019-08-06 | Finisar Corporation | High power cavity package for light emitters |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202925C (en:Method) * | 1969-04-30 | 1900-01-01 | ||
| US3277957A (en) * | 1964-04-03 | 1966-10-11 | Westinghouse Electric Corp | Heat transfer apparatus for electronic component |
| US3405323A (en) * | 1967-03-20 | 1968-10-08 | Ibm | Apparatus for cooling electrical components |
| JPS5332233B1 (en:Method) * | 1968-12-25 | 1978-09-07 | ||
| US3634600A (en) * | 1969-07-22 | 1972-01-11 | Ceramic Metal Systems Inc | Ceramic package |
| US3601522A (en) * | 1970-06-18 | 1971-08-24 | American Lava Corp | Composite ceramic package breakaway notch |
-
1972
- 1972-11-14 JP JP47114643A patent/JPS5228547B2/ja not_active Expired
-
1973
- 1973-07-05 AT AT594773A patent/AT356713B/de not_active IP Right Cessation
- 1973-07-05 BR BR5010/73A patent/BR7305010D0/pt unknown
- 1973-07-09 IT IT26386/73A patent/IT991087B/it active
- 1973-07-09 NO NO2813/73A patent/NO143441C/no unknown
- 1973-07-10 ES ES417197A patent/ES417197A1/es not_active Expired
-
1974
- 1974-12-20 US US05/534,853 patent/US4115837A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| BR7305010D0 (pt) | 1974-08-22 |
| ES417197A1 (es) | 1976-06-01 |
| IT991087B (it) | 1975-07-30 |
| US4115837A (en) | 1978-09-19 |
| NO143441C (no) | 1981-02-11 |
| AT356713B (de) | 1980-05-27 |
| JPS4938575A (en:Method) | 1974-04-10 |
| ATA594773A (de) | 1979-10-15 |
| NO143441B (no) | 1980-11-03 |