JPS5228547B2 - - Google Patents

Info

Publication number
JPS5228547B2
JPS5228547B2 JP47114643A JP11464372A JPS5228547B2 JP S5228547 B2 JPS5228547 B2 JP S5228547B2 JP 47114643 A JP47114643 A JP 47114643A JP 11464372 A JP11464372 A JP 11464372A JP S5228547 B2 JPS5228547 B2 JP S5228547B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP47114643A
Other languages
Japanese (ja)
Other versions
JPS4938575A (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4938575A publication Critical patent/JPS4938575A/ja
Publication of JPS5228547B2 publication Critical patent/JPS5228547B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
JP47114643A 1972-07-10 1972-11-14 Expired JPS5228547B2 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27044872A 1972-07-10 1972-07-10

Publications (2)

Publication Number Publication Date
JPS4938575A JPS4938575A (en:Method) 1974-04-10
JPS5228547B2 true JPS5228547B2 (en:Method) 1977-07-27

Family

ID=23031361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47114643A Expired JPS5228547B2 (en:Method) 1972-07-10 1972-11-14

Country Status (7)

Country Link
US (1) US4115837A (en:Method)
JP (1) JPS5228547B2 (en:Method)
AT (1) AT356713B (en:Method)
BR (1) BR7305010D0 (en:Method)
ES (1) ES417197A1 (en:Method)
IT (1) IT991087B (en:Method)
NO (1) NO143441C (en:Method)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5433830Y2 (en:Method) * 1974-05-31 1979-10-17
JPS5213772A (en) * 1975-07-22 1977-02-02 Kyocera Corp Ic package
JPS5236472A (en) * 1975-09-17 1977-03-19 Mitsubishi Electric Corp Semiconductor unit
JPS5471572A (en) * 1977-11-18 1979-06-08 Fujitsu Ltd Semiconductor device
DE3061383D1 (en) * 1979-02-19 1983-01-27 Fujitsu Ltd Semiconductor device and method for manufacturing the same
US4278990A (en) * 1979-03-19 1981-07-14 General Electric Company Low thermal resistance, low stress semiconductor package
US4288841A (en) * 1979-09-20 1981-09-08 Bell Telephone Laboratories, Incorporated Double cavity semiconductor chip carrier
WO1981003734A1 (en) * 1980-06-19 1981-12-24 Digital Equipment Corp Heat pin integrated circuit packaging
JPS59139652A (ja) * 1983-12-02 1984-08-10 Hitachi Ltd 電子回路装置の実装構造
US4633371A (en) * 1984-09-17 1986-12-30 Amdahl Corporation Heat pipe heat exchanger for large scale integrated circuits
EP0180906B1 (de) * 1984-11-02 1989-01-18 Siemens Aktiengesellschaft Wellenwiderstandsgetreuer Chipträger für Mikrowellenhalbleiter
US4916515A (en) * 1985-06-03 1990-04-10 Levi Clifford A Microwave circuit integrating
JPS63181399A (ja) * 1987-01-22 1988-07-26 日本特殊陶業株式会社 高熱伝導性厚膜多層配線基板
US5159750A (en) * 1989-12-20 1992-11-03 National Semiconductor Corporation Method of connecting an IC component with another electrical component
US5008734A (en) * 1989-12-20 1991-04-16 National Semiconductor Corporation Stadium-stepped package for an integrated circuit with air dielectric
EP0435155B1 (en) * 1989-12-29 1994-06-01 Sumitomo Electric Industries, Ltd. Radiating fin having improved life and thermal conductivity
JPH04164361A (ja) * 1990-10-29 1992-06-10 Nec Corp 樹脂封止型半導体装置
US5325268A (en) * 1993-01-28 1994-06-28 National Semiconductor Corporation Interconnector for a multi-chip module or package
KR101243691B1 (ko) * 2004-10-22 2013-03-14 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 열싱크가 향상된 반도체 발광 장치
US20130187286A1 (en) * 2011-07-25 2013-07-25 Richard Schneider Lead frameless hermetic circuit package
US10374387B2 (en) * 2017-11-10 2019-08-06 Finisar Corporation High power cavity package for light emitters

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202925C (en:Method) * 1969-04-30 1900-01-01
US3277957A (en) * 1964-04-03 1966-10-11 Westinghouse Electric Corp Heat transfer apparatus for electronic component
US3405323A (en) * 1967-03-20 1968-10-08 Ibm Apparatus for cooling electrical components
JPS5332233B1 (en:Method) * 1968-12-25 1978-09-07
US3634600A (en) * 1969-07-22 1972-01-11 Ceramic Metal Systems Inc Ceramic package
US3601522A (en) * 1970-06-18 1971-08-24 American Lava Corp Composite ceramic package breakaway notch

Also Published As

Publication number Publication date
JPS4938575A (en:Method) 1974-04-10
IT991087B (it) 1975-07-30
ES417197A1 (es) 1976-06-01
US4115837A (en) 1978-09-19
ATA594773A (de) 1979-10-15
AT356713B (de) 1980-05-27
NO143441B (no) 1980-11-03
NO143441C (no) 1981-02-11
BR7305010D0 (pt) 1974-08-22

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