JPS5227594A - Heat sensing material composed of polyamid component - Google Patents

Heat sensing material composed of polyamid component

Info

Publication number
JPS5227594A
JPS5227594A JP10366975A JP10366975A JPS5227594A JP S5227594 A JPS5227594 A JP S5227594A JP 10366975 A JP10366975 A JP 10366975A JP 10366975 A JP10366975 A JP 10366975A JP S5227594 A JPS5227594 A JP S5227594A
Authority
JP
Japan
Prior art keywords
sensing material
polyamid
component
material composed
heat sensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10366975A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5723962B2 (OSRAM
Inventor
Minoru Kamosaki
Kazuhiko Koto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daicel Corp
Original Assignee
Daicel Corp
Daicel Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Corp, Daicel Chemical Industries Ltd filed Critical Daicel Corp
Priority to JP10366975A priority Critical patent/JPS5227594A/ja
Publication of JPS5227594A publication Critical patent/JPS5227594A/ja
Publication of JPS5723962B2 publication Critical patent/JPS5723962B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Thermistors And Varistors (AREA)
JP10366975A 1975-08-27 1975-08-27 Heat sensing material composed of polyamid component Granted JPS5227594A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10366975A JPS5227594A (en) 1975-08-27 1975-08-27 Heat sensing material composed of polyamid component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10366975A JPS5227594A (en) 1975-08-27 1975-08-27 Heat sensing material composed of polyamid component

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP14262180A Division JPS592467B2 (ja) 1980-10-13 1980-10-13 ポリアミド組成物からなる熱感応性の材料

Publications (2)

Publication Number Publication Date
JPS5227594A true JPS5227594A (en) 1977-03-01
JPS5723962B2 JPS5723962B2 (OSRAM) 1982-05-21

Family

ID=14360186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10366975A Granted JPS5227594A (en) 1975-08-27 1975-08-27 Heat sensing material composed of polyamid component

Country Status (1)

Country Link
JP (1) JPS5227594A (OSRAM)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5661454A (en) * 1979-10-26 1981-05-26 Toray Ind Inc Heat-sensitive element consisting of polyamide composition
JPS58215449A (ja) * 1982-06-08 1983-12-14 Daicel Chem Ind Ltd 高分子感温体
JPS58225151A (ja) * 1982-06-21 1983-12-27 Daicel Chem Ind Ltd 高分子感温材料
JPS5927949A (ja) * 1982-08-06 1984-02-14 Daicel Chem Ind Ltd 添加剤の仕込方法
WO2023032780A1 (ja) * 2021-09-01 2023-03-09 Ｕｂｅ株式会社 ポリアミド樹脂組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06155266A (ja) * 1992-11-26 1994-06-03 Shitara Seisakusho:Kk ヘルメット研磨装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4996290A (OSRAM) * 1973-01-20 1974-09-12
JPS5018997A (OSRAM) * 1972-12-28 1975-02-27
JPS5018996A (OSRAM) * 1972-12-28 1975-02-27

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5018997A (OSRAM) * 1972-12-28 1975-02-27
JPS5018996A (OSRAM) * 1972-12-28 1975-02-27
JPS4996290A (OSRAM) * 1973-01-20 1974-09-12

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5661454A (en) * 1979-10-26 1981-05-26 Toray Ind Inc Heat-sensitive element consisting of polyamide composition
JPS58215449A (ja) * 1982-06-08 1983-12-14 Daicel Chem Ind Ltd 高分子感温体
JPS58225151A (ja) * 1982-06-21 1983-12-27 Daicel Chem Ind Ltd 高分子感温材料
JPS5927949A (ja) * 1982-08-06 1984-02-14 Daicel Chem Ind Ltd 添加剤の仕込方法
WO2023032780A1 (ja) * 2021-09-01 2023-03-09 Ｕｂｅ株式会社 ポリアミド樹脂組成物

Also Published As

Publication number Publication date
JPS5723962B2 (OSRAM) 1982-05-21

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