JPS5222071A - Method of selective etching of film of polyamide resin - Google Patents

Method of selective etching of film of polyamide resin

Info

Publication number
JPS5222071A
JPS5222071A JP50098179A JP9817975A JPS5222071A JP S5222071 A JPS5222071 A JP S5222071A JP 50098179 A JP50098179 A JP 50098179A JP 9817975 A JP9817975 A JP 9817975A JP S5222071 A JPS5222071 A JP S5222071A
Authority
JP
Japan
Prior art keywords
film
polyamide resin
selective etching
etching
selective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50098179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5328342B2 (US06650917-20031118-M00005.png
Inventor
Atsushi Saiki
Toshio Ookubo
Tadayoshi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50098179A priority Critical patent/JPS5222071A/ja
Priority to DE2618937A priority patent/DE2618937C3/de
Priority to NL7604652A priority patent/NL7604652A/xx
Priority to GB17720/76A priority patent/GB1510944A/en
Priority to FR7613338A priority patent/FR2321190A1/fr
Priority to US05/695,040 priority patent/US4113550A/en
Publication of JPS5222071A publication Critical patent/JPS5222071A/ja
Priority to US05/924,008 priority patent/US4218283A/en
Publication of JPS5328342B2 publication Critical patent/JPS5328342B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76804—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics by forming tapered via holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
    • H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
    • H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Weting (AREA)
  • Formation Of Insulating Films (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP50098179A 1974-08-23 1975-08-13 Method of selective etching of film of polyamide resin Granted JPS5222071A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP50098179A JPS5222071A (en) 1975-08-13 1975-08-13 Method of selective etching of film of polyamide resin
DE2618937A DE2618937C3 (de) 1975-08-13 1976-04-29 Ätzmittel für Polymerisatharze, insbesondere für die Halbleiterherstellung, und Verfahren zur Herstellung von Halbleiterbauelementen unter Verwendung dieses Ätzmittels
NL7604652A NL7604652A (nl) 1975-08-13 1976-04-29 Werkwijze voor de vervaardiging van halfgelei- ders.
GB17720/76A GB1510944A (en) 1975-08-13 1976-04-30 Method for fabricating semiconductor device and etchant for polymer resin
FR7613338A FR2321190A1 (fr) 1975-08-13 1976-05-05 Composant semi-conducteur et son procede de fabrication
US05/695,040 US4113550A (en) 1974-08-23 1976-06-11 Method for fabricating semiconductor device and etchant for polymer resin
US05/924,008 US4218283A (en) 1974-08-23 1978-07-12 Method for fabricating semiconductor device and etchant for polymer resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50098179A JPS5222071A (en) 1975-08-13 1975-08-13 Method of selective etching of film of polyamide resin

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP5151979A Division JPS557880A (en) 1979-04-27 1979-04-27 Etching solution for organic resin

Publications (2)

Publication Number Publication Date
JPS5222071A true JPS5222071A (en) 1977-02-19
JPS5328342B2 JPS5328342B2 (US06650917-20031118-M00005.png) 1978-08-14

Family

ID=14212791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50098179A Granted JPS5222071A (en) 1974-08-23 1975-08-13 Method of selective etching of film of polyamide resin

Country Status (5)

Country Link
JP (1) JPS5222071A (US06650917-20031118-M00005.png)
DE (1) DE2618937C3 (US06650917-20031118-M00005.png)
FR (1) FR2321190A1 (US06650917-20031118-M00005.png)
GB (1) GB1510944A (US06650917-20031118-M00005.png)
NL (1) NL7604652A (US06650917-20031118-M00005.png)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54179102U (US06650917-20031118-M00005.png) * 1978-06-07 1979-12-18
JPS557880A (en) * 1979-04-27 1980-01-21 Hitachi Ltd Etching solution for organic resin
JPS5515502A (en) * 1978-07-18 1980-02-02 Hitachi Ltd Running control system for manless wagon
US6303230B1 (en) 1995-01-17 2001-10-16 Nippon Steel Chemical Co., Ltd. Laminates

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54106599A (en) * 1978-02-09 1979-08-21 Hitachi Chem Co Ltd Preparation of polyamide intermediate for semiconductor processing
JPS58108229A (ja) * 1981-12-21 1983-06-28 Hitachi Ltd ポリイミド系樹脂膜の選択エツチング方法
FR2525389A1 (fr) * 1982-04-14 1983-10-21 Commissariat Energie Atomique Procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre
FR2550660B2 (fr) * 1982-04-14 1987-11-06 Commissariat Energie Atomique Perfectionnement au procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre
FR2537779B1 (fr) * 1982-12-10 1986-03-14 Commissariat Energie Atomique Procede de positionnement d'un trou de contact electrique entre deux lignes d'interconnexion d'un circuit integre
DE3475856D1 (en) * 1983-08-12 1989-02-02 Commissariat Energie Atomique Method for aligning a connecting line above an electrical contact hole of an integrated circuit
EP0511691A3 (en) * 1988-07-13 1993-03-03 International Business Machines Corporation Wet etching of cured polyimide

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49120504A (US06650917-20031118-M00005.png) * 1973-03-16 1974-11-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49120504A (US06650917-20031118-M00005.png) * 1973-03-16 1974-11-18

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54179102U (US06650917-20031118-M00005.png) * 1978-06-07 1979-12-18
JPS5515502A (en) * 1978-07-18 1980-02-02 Hitachi Ltd Running control system for manless wagon
JPS6220567B2 (US06650917-20031118-M00005.png) * 1978-07-18 1987-05-07 Hitachi Ltd
JPS557880A (en) * 1979-04-27 1980-01-21 Hitachi Ltd Etching solution for organic resin
US6303230B1 (en) 1995-01-17 2001-10-16 Nippon Steel Chemical Co., Ltd. Laminates

Also Published As

Publication number Publication date
DE2618937A1 (de) 1977-02-17
FR2321190B1 (US06650917-20031118-M00005.png) 1979-08-17
GB1510944A (en) 1978-05-17
FR2321190A1 (fr) 1977-03-11
DE2618937C3 (de) 1979-02-22
JPS5328342B2 (US06650917-20031118-M00005.png) 1978-08-14
NL7604652A (nl) 1977-02-15
DE2618937B2 (de) 1978-06-29

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