FR2550660B2 - Perfectionnement au procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre - Google Patents

Perfectionnement au procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre

Info

Publication number
FR2550660B2
FR2550660B2 FR8313282A FR8313282A FR2550660B2 FR 2550660 B2 FR2550660 B2 FR 2550660B2 FR 8313282 A FR8313282 A FR 8313282A FR 8313282 A FR8313282 A FR 8313282A FR 2550660 B2 FR2550660 B2 FR 2550660B2
Authority
FR
France
Prior art keywords
positioning
improvement
integrated circuit
contact hole
electric contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8313282A
Other languages
English (en)
Other versions
FR2550660A2 (fr
Inventor
Pierre Jeuch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR8206409A external-priority patent/FR2525389A1/fr
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Priority to FR8313282A priority Critical patent/FR2550660B2/fr
Priority to EP84401636A priority patent/EP0139549B1/fr
Priority to DE8484401636T priority patent/DE3475856D1/de
Priority to US06/639,587 priority patent/US4541892A/en
Priority to JP59166673A priority patent/JPS6055642A/ja
Publication of FR2550660A2 publication Critical patent/FR2550660A2/fr
Application granted granted Critical
Publication of FR2550660B2 publication Critical patent/FR2550660B2/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/5329—Insulating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
FR8313282A 1982-04-14 1983-08-12 Perfectionnement au procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre Expired FR2550660B2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
FR8313282A FR2550660B2 (fr) 1982-04-14 1983-08-12 Perfectionnement au procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre
EP84401636A EP0139549B1 (fr) 1983-08-12 1984-08-06 Procédé de positionnement d'une ligne d'interconnexion sur un trou de contact électrique d'un circuit intégré
DE8484401636T DE3475856D1 (en) 1983-08-12 1984-08-06 Method for aligning a connecting line above an electrical contact hole of an integrated circuit
US06/639,587 US4541892A (en) 1983-08-12 1984-08-10 Process for the positioning of an interconnection line on an electrical contact hole of an integrated circuit
JP59166673A JPS6055642A (ja) 1983-08-12 1984-08-10 集積回路の接続線設置方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8206409A FR2525389A1 (fr) 1982-04-14 1982-04-14 Procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre
FR8313282A FR2550660B2 (fr) 1982-04-14 1983-08-12 Perfectionnement au procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre

Publications (2)

Publication Number Publication Date
FR2550660A2 FR2550660A2 (fr) 1985-02-15
FR2550660B2 true FR2550660B2 (fr) 1987-11-06

Family

ID=26222861

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8313282A Expired FR2550660B2 (fr) 1982-04-14 1983-08-12 Perfectionnement au procede de positionnement d'une ligne d'interconnexion sur un trou de contact electrique d'un circuit integre

Country Status (1)

Country Link
FR (1) FR2550660B2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6701561B2 (en) 2001-09-10 2004-03-09 Honeywell International Inc. Method and system for detecting fluid injection from stationary to rotating members

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5222071A (en) * 1975-08-13 1977-02-19 Hitachi Ltd Method of selective etching of film of polyamide resin
FR2428915A1 (fr) * 1978-06-14 1980-01-11 Fujitsu Ltd Procede de fabrication d'un dispositif a semi-conducteurs
DE3164742D1 (en) * 1980-09-22 1984-08-16 Tokyo Shibaura Electric Co Method of smoothing an insulating layer formed on a semiconductor body
US4492717A (en) * 1981-07-27 1985-01-08 International Business Machines Corporation Method for forming a planarized integrated circuit

Also Published As

Publication number Publication date
FR2550660A2 (fr) 1985-02-15

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