JPS5212458A - Method of forming throughhholes in resin film - Google Patents

Method of forming throughhholes in resin film

Info

Publication number
JPS5212458A
JPS5212458A JP8775775A JP8775775A JPS5212458A JP S5212458 A JPS5212458 A JP S5212458A JP 8775775 A JP8775775 A JP 8775775A JP 8775775 A JP8775775 A JP 8775775A JP S5212458 A JPS5212458 A JP S5212458A
Authority
JP
Japan
Prior art keywords
throughhholes
forming
resin film
resin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8775775A
Other languages
Japanese (ja)
Other versions
JPS5823943B2 (en
Inventor
Tsuyoshi Shirakezawa
Masaharu Iyori
Isamu Kitahiro
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8775775A priority Critical patent/JPS5823943B2/en
Publication of JPS5212458A publication Critical patent/JPS5212458A/en
Publication of JPS5823943B2 publication Critical patent/JPS5823943B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
JP8775775A 1975-07-16 1975-07-16 Method for forming through electrodes in insulators Expired JPS5823943B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8775775A JPS5823943B2 (en) 1975-07-16 1975-07-16 Method for forming through electrodes in insulators

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8775775A JPS5823943B2 (en) 1975-07-16 1975-07-16 Method for forming through electrodes in insulators

Publications (2)

Publication Number Publication Date
JPS5212458A true JPS5212458A (en) 1977-01-31
JPS5823943B2 JPS5823943B2 (en) 1983-05-18

Family

ID=13923806

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8775775A Expired JPS5823943B2 (en) 1975-07-16 1975-07-16 Method for forming through electrodes in insulators

Country Status (1)

Country Link
JP (1) JPS5823943B2 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006073589A (en) * 2004-08-31 2006-03-16 Toppan Printing Co Ltd Wiring board and its manufacturing method, semiconductor package, and printed wiring board
JP2008141156A (en) * 2006-11-30 2008-06-19 Sanyo Electric Co Ltd Circuit apparatus
JPWO2006028090A1 (en) * 2004-09-06 2008-07-31 テセラ・インターコネクト・マテリアルズ，インコーポレイテッド Member for connecting wiring films and method of manufacturing the same
US7546681B2 (en) 1999-10-12 2009-06-16 Tessera Interconnect Materials, Inc. Manufacturing method for wiring circuit substrate
JP2009182274A (en) * 2008-01-31 2009-08-13 Sanyo Electric Co Ltd Device packaging board and method for manufacturing same, semiconductor module and method for manufacturing same, and portable device
JP2011049606A (en) * 2007-11-08 2011-03-10 Sanyo Electric Co Ltd Method of manufacturing semiconductor module
US9365947B2 (en) 2013-10-04 2016-06-14 Invensas Corporation Method for preparing low cost substrates

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6212031Y2 (en) * 1981-10-03 1987-03-25

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7546681B2 (en) 1999-10-12 2009-06-16 Tessera Interconnect Materials, Inc. Manufacturing method for wiring circuit substrate
US7721422B2 (en) 1999-10-12 2010-05-25 Tessera Interconnect Materials, Inc. Methods of making microelectronic assemblies
JP2006073589A (en) * 2004-08-31 2006-03-16 Toppan Printing Co Ltd Wiring board and its manufacturing method, semiconductor package, and printed wiring board
JP4548047B2 (en) * 2004-08-31 2010-09-22 凸版印刷株式会社 Wiring board manufacturing method
JPWO2006028090A1 (en) * 2004-09-06 2008-07-31 テセラ・インターコネクト・マテリアルズ，インコーポレイテッド Member for connecting wiring films and method of manufacturing the same
JP2008141156A (en) * 2006-11-30 2008-06-19 Sanyo Electric Co Ltd Circuit apparatus
JP2011049606A (en) * 2007-11-08 2011-03-10 Sanyo Electric Co Ltd Method of manufacturing semiconductor module
JP2009182274A (en) * 2008-01-31 2009-08-13 Sanyo Electric Co Ltd Device packaging board and method for manufacturing same, semiconductor module and method for manufacturing same, and portable device
US9365947B2 (en) 2013-10-04 2016-06-14 Invensas Corporation Method for preparing low cost substrates
US10283484B2 (en) 2013-10-04 2019-05-07 Invensas Corporation Low cost substrates

Also Published As

Publication number Publication date
JPS5823943B2 (en) 1983-05-18

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