JPS52143946A - Mechanism for elevationally moving bonding arm - Google Patents

Mechanism for elevationally moving bonding arm

Info

Publication number
JPS52143946A
JPS52143946A JP6002276A JP6002276A JPS52143946A JP S52143946 A JPS52143946 A JP S52143946A JP 6002276 A JP6002276 A JP 6002276A JP 6002276 A JP6002276 A JP 6002276A JP S52143946 A JPS52143946 A JP S52143946A
Authority
JP
Japan
Prior art keywords
bonding arm
elevationally moving
moving bonding
elevationally
arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6002276A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6139733B2 (enrdf_load_stackoverflow
Inventor
Shiyunichirou Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6002276A priority Critical patent/JPS52143946A/ja
Publication of JPS52143946A publication Critical patent/JPS52143946A/ja
Publication of JPS6139733B2 publication Critical patent/JPS6139733B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP6002276A 1976-05-26 1976-05-26 Mechanism for elevationally moving bonding arm Granted JPS52143946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6002276A JPS52143946A (en) 1976-05-26 1976-05-26 Mechanism for elevationally moving bonding arm

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6002276A JPS52143946A (en) 1976-05-26 1976-05-26 Mechanism for elevationally moving bonding arm

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP18261984A Division JPS6074447A (ja) 1984-09-03 1984-09-03 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS52143946A true JPS52143946A (en) 1977-11-30
JPS6139733B2 JPS6139733B2 (enrdf_load_stackoverflow) 1986-09-05

Family

ID=13130014

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6002276A Granted JPS52143946A (en) 1976-05-26 1976-05-26 Mechanism for elevationally moving bonding arm

Country Status (1)

Country Link
JP (1) JPS52143946A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101667A (en) * 1978-01-27 1979-08-10 Hitachi Ltd Wire bonding unit
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPS5630735A (en) * 1979-08-21 1981-03-27 Nec Corp Wire-bonding device
JPS5633848A (en) * 1979-08-28 1981-04-04 Nec Kyushu Ltd Manufacturing equipment for semiconductor device
JPS5691438A (en) * 1979-12-26 1981-07-24 Hitachi Ltd Method for bonding pellet
JPS5752435U (enrdf_load_stackoverflow) * 1980-09-11 1982-03-26
JPS63100737A (ja) * 1986-10-17 1988-05-02 Tokyo Sokuhan Kk ダイボンデイング方法
JPH01144642A (ja) * 1988-07-08 1989-06-06 Nec Corp ワイヤボンデイング方法
JP2008058783A (ja) * 2006-09-01 2008-03-13 Four Nines:Kk 眼鏡フレーム

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62140124U (enrdf_load_stackoverflow) * 1986-02-27 1987-09-04

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101667A (en) * 1978-01-27 1979-08-10 Hitachi Ltd Wire bonding unit
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPS5630735A (en) * 1979-08-21 1981-03-27 Nec Corp Wire-bonding device
JPS5633848A (en) * 1979-08-28 1981-04-04 Nec Kyushu Ltd Manufacturing equipment for semiconductor device
JPS5691438A (en) * 1979-12-26 1981-07-24 Hitachi Ltd Method for bonding pellet
JPS5752435U (enrdf_load_stackoverflow) * 1980-09-11 1982-03-26
JPS63100737A (ja) * 1986-10-17 1988-05-02 Tokyo Sokuhan Kk ダイボンデイング方法
JPH01144642A (ja) * 1988-07-08 1989-06-06 Nec Corp ワイヤボンデイング方法
JP2008058783A (ja) * 2006-09-01 2008-03-13 Four Nines:Kk 眼鏡フレーム

Also Published As

Publication number Publication date
JPS6139733B2 (enrdf_load_stackoverflow) 1986-09-05

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