JPS52129377A - Die bonding device - Google Patents

Die bonding device

Info

Publication number
JPS52129377A
JPS52129377A JP4550676A JP4550676A JPS52129377A JP S52129377 A JPS52129377 A JP S52129377A JP 4550676 A JP4550676 A JP 4550676A JP 4550676 A JP4550676 A JP 4550676A JP S52129377 A JPS52129377 A JP S52129377A
Authority
JP
Japan
Prior art keywords
collet
die bonding
bonding device
groove
tubular
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4550676A
Other languages
Japanese (ja)
Inventor
Osamu Yamaji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4550676A priority Critical patent/JPS52129377A/en
Publication of JPS52129377A publication Critical patent/JPS52129377A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Abstract

PURPOSE: To simplify positioning of a chip and a suction collet by slidably fitting a tubular collet onto the outside of a main collet having an inverted pyramidal groove and forming the same tapered plane continuous to the tapered part of said groove to the inside end of said tubular collet.
COPYRIGHT: (C)1977,JPO&Japio
JP4550676A 1976-04-23 1976-04-23 Die bonding device Pending JPS52129377A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4550676A JPS52129377A (en) 1976-04-23 1976-04-23 Die bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4550676A JPS52129377A (en) 1976-04-23 1976-04-23 Die bonding device

Publications (1)

Publication Number Publication Date
JPS52129377A true JPS52129377A (en) 1977-10-29

Family

ID=12721289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4550676A Pending JPS52129377A (en) 1976-04-23 1976-04-23 Die bonding device

Country Status (1)

Country Link
JP (1) JPS52129377A (en)

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