JPS5186367A - Butsupinshorihoho oyobisochi - Google Patents

Butsupinshorihoho oyobisochi

Info

Publication number
JPS5186367A
JPS5186367A JP50150769A JP15076975A JPS5186367A JP S5186367 A JPS5186367 A JP S5186367A JP 50150769 A JP50150769 A JP 50150769A JP 15076975 A JP15076975 A JP 15076975A JP S5186367 A JPS5186367 A JP S5186367A
Authority
JP
Japan
Prior art keywords
oyobisochi
butsupinshorihoho
butsupinshorihoho oyobisochi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50150769A
Other languages
English (en)
Japanese (ja)
Inventor
Forbes Johnson Anderson Jr
Larry Stork Edward
Harold Winings Richard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of JPS5186367A publication Critical patent/JPS5186367A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/15—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
  • Non-Mechanical Conveyors (AREA)
JP50150769A 1974-12-20 1975-12-19 Butsupinshorihoho oyobisochi Pending JPS5186367A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/534,918 US3977926A (en) 1974-12-20 1974-12-20 Methods for treating articles

Publications (1)

Publication Number Publication Date
JPS5186367A true JPS5186367A (en) 1976-07-28

Family

ID=24132067

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50150769A Pending JPS5186367A (en) 1974-12-20 1975-12-19 Butsupinshorihoho oyobisochi

Country Status (6)

Country Link
US (2) US3977926A (oth)
JP (1) JPS5186367A (oth)
CA (1) CA1038503A (oth)
DE (1) DE2557367A1 (oth)
FR (1) FR2295567A1 (oth)
GB (1) GB1486709A (oth)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4251317A (en) * 1979-04-30 1981-02-17 Fairchild Camera And Instrument Corporation Method of preventing etch masking during wafer etching
US4300581A (en) * 1980-03-06 1981-11-17 Thompson Raymon F Centrifugal wafer processor
CA1158109A (en) * 1981-01-14 1983-12-06 George M. Jenkins Coating of semiconductor wafers and apparatus therefor
US4458704A (en) * 1982-10-29 1984-07-10 Xertronix, Inc. Apparatus for processing semiconductor wafers
FR2544879B1 (fr) * 1983-04-21 1987-06-12 Prat Jacques Dispositif pour le nettoyage et la sterilisation thermique de lentilles de contact souples hydrophiles
US4984597B1 (en) * 1984-05-21 1999-10-26 Cfmt Inc Apparatus for rinsing and drying surfaces
US4740249A (en) * 1984-05-21 1988-04-26 Christopher F. McConnell Method of treating wafers with fluid
US4577650A (en) * 1984-05-21 1986-03-25 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
US4856544A (en) * 1984-05-21 1989-08-15 Cfm Technologies, Inc. Vessel and system for treating wafers with fluids
US4911761A (en) * 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
US4738272A (en) * 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4633893A (en) * 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
US4675067A (en) * 1984-06-13 1987-06-23 The United States Of America As Represented By The Secretary Of The Air Force Solar cell coverslide extraction apparatus
FR2597368A1 (fr) * 1986-04-17 1987-10-23 Guilbaud Jean Pierre Dispositif pour le traitement de produits divers par immersion dans des liquides puis essorage.
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
JPH07122132B2 (ja) * 1990-11-01 1995-12-25 松下電器産業株式会社 薄膜形成方法および薄膜形成装置
US5103847A (en) * 1990-11-13 1992-04-14 Westinghouse Electric Corp. Device for supporting tube bundles for cleaning
DE4103084A1 (de) * 1991-02-01 1992-08-13 Wacker Chemitronic Magazin zur halterung von scheibenfoermigen werkstuecken, insbesondere halbleiterscheiben, bei der nasschemischen oberflaechenbehandlung in fluessigkeitsbaedern
JPH04299828A (ja) * 1991-03-28 1992-10-23 Shin Etsu Handotai Co Ltd 半導体基板処理装置
DE69233293T2 (de) * 1991-10-04 2004-11-18 CFMT, Inc., Wilmington Superreinigung von komplizierten Mikroteilchen
US5224503A (en) * 1992-06-15 1993-07-06 Semitool, Inc. Centrifugal wafer carrier cleaning apparatus
FR2698639B1 (fr) * 1992-12-01 1995-03-24 Sgs Thomson Microelectronics Machine de gravure chimique de silicium.
US5863348A (en) * 1993-12-22 1999-01-26 International Business Machines Corporation Programmable method for cleaning semiconductor elements
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
US6833035B1 (en) * 1994-04-28 2004-12-21 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station
US5593505A (en) * 1995-04-19 1997-01-14 Memc Electronic Materials, Inc. Method for cleaning semiconductor wafers with sonic energy and passing through a gas-liquid-interface
US5968849A (en) * 1995-06-26 1999-10-19 Motorola, Inc. Method for pre-shaping a semiconductor substrate for polishing and structure
JP3050524B2 (ja) * 1996-05-09 2000-06-12 スピードファムクリーンシステム株式会社 ワーク搬送用キャリヤ装置
US6039059A (en) 1996-09-30 2000-03-21 Verteq, Inc. Wafer cleaning system
US5865894A (en) * 1997-06-11 1999-02-02 Reynolds Tech Fabricators, Inc. Megasonic plating system
US5843322A (en) * 1996-12-23 1998-12-01 Memc Electronic Materials, Inc. Process for etching N, P, N+ and P+ type slugs and wafers
WO1998035765A1 (en) * 1997-02-18 1998-08-20 Scp Global Technologies Multiple stage wet processing chamber
US6125863A (en) * 1998-06-30 2000-10-03 Semitool, Inc. Offset rotor flat media processor
US6062239A (en) * 1998-06-30 2000-05-16 Semitool, Inc. Cross flow centrifugal processor
US6432214B2 (en) 1998-07-10 2002-08-13 Semitool, Inc. Cleaning apparatus
US6328809B1 (en) 1998-10-09 2001-12-11 Scp Global Technologies, Inc. Vapor drying system and method
JP3316748B2 (ja) * 1998-10-20 2002-08-19 株式会社村田製作所 無電解めっき用ホルダおよび無電解めっき方法
US6918864B1 (en) * 1999-06-01 2005-07-19 Applied Materials, Inc. Roller that avoids substrate slippage
US20070095366A1 (en) * 2005-11-02 2007-05-03 Applied Materials, Inc. Stripping and cleaning of organic-containing materials from electronic device substrate surfaces
CN103241537B (zh) * 2013-04-24 2015-08-05 北京优纳科技有限公司 切片装载装置
CN105083143A (zh) 2014-09-18 2015-11-25 宁波万汇窗篷用品有限公司 遮阳篷装置
CN106702496B (zh) * 2015-07-20 2019-01-25 有研半导体材料有限公司 一种酸腐蚀去除硅晶圆表面损伤的装置及方法
US10428549B2 (en) 2016-04-01 2019-10-01 ZHUN-AN Ma Awning apparatus
CN108166688B (zh) 2017-05-08 2019-11-05 宁波万汇休闲用品有限公司 遮蔽篷装置
EP3495582A1 (en) 2017-12-08 2019-06-12 Activa Awning Inc. Awning apparatus
EP3995643A1 (en) 2020-11-04 2022-05-11 Qingdao Activa Shade Inc. Retractable shade structures

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3428059A (en) * 1967-04-03 1969-02-18 Geoscience Instr Corp Rotary basket processing apparatus
DE1915714C3 (de) * 1969-03-27 1975-07-10 Robert Bosch Gmbh, 7000 Stuttgart Vorrichtung zum Xtzen von Halbleiterscheiben mit einem mit Ätzflüssigkeit gefüllten Gefäß und einem in die Ätzflüssigkeit eingetauchten, mit waagrechter Achse rotierenden Ätzkorb
US3841689A (en) * 1973-06-29 1974-10-15 Bell Telephone Labor Inc Semiconductor wafer transfer fixture

Also Published As

Publication number Publication date
DE2557367A1 (de) 1976-06-24
FR2295567A1 (fr) 1976-07-16
GB1486709A (en) 1977-09-21
FR2295567B1 (oth) 1979-04-27
US4077416A (en) 1978-03-07
CA1038503A (en) 1978-09-12
US3977926A (en) 1976-08-31

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