FR2295567A1 - Procedes et dispositifs pour traiter des objets, tels que par exemple des pastilles faites avec une matiere semi-conductrice - Google Patents

Procedes et dispositifs pour traiter des objets, tels que par exemple des pastilles faites avec une matiere semi-conductrice

Info

Publication number
FR2295567A1
FR2295567A1 FR7538309A FR7538309A FR2295567A1 FR 2295567 A1 FR2295567 A1 FR 2295567A1 FR 7538309 A FR7538309 A FR 7538309A FR 7538309 A FR7538309 A FR 7538309A FR 2295567 A1 FR2295567 A1 FR 2295567A1
Authority
FR
France
Prior art keywords
methods
devices
semiconductor material
processing objects
pellets made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7538309A
Other languages
English (en)
Other versions
FR2295567B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Publication of FR2295567A1 publication Critical patent/FR2295567A1/fr
Application granted granted Critical
Publication of FR2295567B1 publication Critical patent/FR2295567B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Mechanical Conveyors (AREA)
FR7538309A 1974-12-20 1975-12-15 Procedes et dispositifs pour traiter des objets, tels que par exemple des pastilles faites avec une matiere semi-conductrice Granted FR2295567A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/534,918 US3977926A (en) 1974-12-20 1974-12-20 Methods for treating articles

Publications (2)

Publication Number Publication Date
FR2295567A1 true FR2295567A1 (fr) 1976-07-16
FR2295567B1 FR2295567B1 (fr) 1979-04-27

Family

ID=24132067

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7538309A Granted FR2295567A1 (fr) 1974-12-20 1975-12-15 Procedes et dispositifs pour traiter des objets, tels que par exemple des pastilles faites avec une matiere semi-conductrice

Country Status (6)

Country Link
US (2) US3977926A (fr)
JP (1) JPS5186367A (fr)
CA (1) CA1038503A (fr)
DE (1) DE2557367A1 (fr)
FR (1) FR2295567A1 (fr)
GB (1) GB1486709A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2597368A1 (fr) * 1986-04-17 1987-10-23 Guilbaud Jean Pierre Dispositif pour le traitement de produits divers par immersion dans des liquides puis essorage.
EP0497104A1 (fr) * 1991-02-01 1992-08-05 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Magasin pour contenir des pièces en forme de disques, en particulier des disques semi-conducteurs, dans un traitement de surface chimique en bains liquides
FR2698639A1 (fr) * 1992-12-01 1994-06-03 Sgs Thomson Microelectronics Machine de gravure chimique de silicium.

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4251317A (en) * 1979-04-30 1981-02-17 Fairchild Camera And Instrument Corporation Method of preventing etch masking during wafer etching
US4300581A (en) * 1980-03-06 1981-11-17 Thompson Raymon F Centrifugal wafer processor
CA1158109A (fr) * 1981-01-14 1983-12-06 George M. Jenkins Methode et dispositif d'enduction de puces a semiconducteurs
US4458704A (en) * 1982-10-29 1984-07-10 Xertronix, Inc. Apparatus for processing semiconductor wafers
FR2544879B1 (fr) * 1983-04-21 1987-06-12 Prat Jacques Dispositif pour le nettoyage et la sterilisation thermique de lentilles de contact souples hydrophiles
US4738272A (en) * 1984-05-21 1988-04-19 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4577650A (en) * 1984-05-21 1986-03-25 Mcconnell Christopher F Vessel and system for treating wafers with fluids
US4633893A (en) * 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
US4740249A (en) * 1984-05-21 1988-04-26 Christopher F. McConnell Method of treating wafers with fluid
US4856544A (en) * 1984-05-21 1989-08-15 Cfm Technologies, Inc. Vessel and system for treating wafers with fluids
US4984597B1 (en) * 1984-05-21 1999-10-26 Cfmt Inc Apparatus for rinsing and drying surfaces
US4778532A (en) * 1985-06-24 1988-10-18 Cfm Technologies Limited Partnership Process and apparatus for treating wafers with process fluids
US4911761A (en) * 1984-05-21 1990-03-27 Cfm Technologies Research Associates Process and apparatus for drying surfaces
US4675067A (en) * 1984-06-13 1987-06-23 The United States Of America As Represented By The Secretary Of The Air Force Solar cell coverslide extraction apparatus
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
JPH07122132B2 (ja) * 1990-11-01 1995-12-25 松下電器産業株式会社 薄膜形成方法および薄膜形成装置
US5103847A (en) * 1990-11-13 1992-04-14 Westinghouse Electric Corp. Device for supporting tube bundles for cleaning
JPH04299828A (ja) * 1991-03-28 1992-10-23 Shin Etsu Handotai Co Ltd 半導体基板処理装置
ATE258084T1 (de) * 1991-10-04 2004-02-15 Cfmt Inc Superreinigung von komplizierten mikroteilchen
US5224503A (en) * 1992-06-15 1993-07-06 Semitool, Inc. Centrifugal wafer carrier cleaning apparatus
US5863348A (en) * 1993-12-22 1999-01-26 International Business Machines Corporation Programmable method for cleaning semiconductor elements
US6712577B2 (en) * 1994-04-28 2004-03-30 Semitool, Inc. Automated semiconductor processing system
US6833035B1 (en) * 1994-04-28 2004-12-21 Semitool, Inc. Semiconductor processing system with wafer container docking and loading station
US5593505A (en) * 1995-04-19 1997-01-14 Memc Electronic Materials, Inc. Method for cleaning semiconductor wafers with sonic energy and passing through a gas-liquid-interface
US5968849A (en) * 1995-06-26 1999-10-19 Motorola, Inc. Method for pre-shaping a semiconductor substrate for polishing and structure
JP3050524B2 (ja) * 1996-05-09 2000-06-12 スピードファムクリーンシステム株式会社 ワーク搬送用キャリヤ装置
US6039059A (en) 1996-09-30 2000-03-21 Verteq, Inc. Wafer cleaning system
US5865894A (en) * 1997-06-11 1999-02-02 Reynolds Tech Fabricators, Inc. Megasonic plating system
US5843322A (en) * 1996-12-23 1998-12-01 Memc Electronic Materials, Inc. Process for etching N, P, N+ and P+ type slugs and wafers
WO1998035765A1 (fr) * 1997-02-18 1998-08-20 Scp Global Technologies Enceinte de traitement humide a etapes multiples
US6125863A (en) * 1998-06-30 2000-10-03 Semitool, Inc. Offset rotor flat media processor
US6062239A (en) * 1998-06-30 2000-05-16 Semitool, Inc. Cross flow centrifugal processor
US6432214B2 (en) 1998-07-10 2002-08-13 Semitool, Inc. Cleaning apparatus
US6328809B1 (en) 1998-10-09 2001-12-11 Scp Global Technologies, Inc. Vapor drying system and method
JP3316748B2 (ja) * 1998-10-20 2002-08-19 株式会社村田製作所 無電解めっき用ホルダおよび無電解めっき方法
US6918864B1 (en) * 1999-06-01 2005-07-19 Applied Materials, Inc. Roller that avoids substrate slippage
US20070095366A1 (en) * 2005-11-02 2007-05-03 Applied Materials, Inc. Stripping and cleaning of organic-containing materials from electronic device substrate surfaces
CN103241537B (zh) * 2013-04-24 2015-08-05 北京优纳科技有限公司 切片装载装置
CN105083143A (zh) 2014-09-18 2015-11-25 宁波万汇窗篷用品有限公司 遮阳篷装置
CN106702496B (zh) * 2015-07-20 2019-01-25 有研半导体材料有限公司 一种酸腐蚀去除硅晶圆表面损伤的装置及方法
US10428549B2 (en) 2016-04-01 2019-10-01 ZHUN-AN Ma Awning apparatus
EP3495582A1 (fr) 2017-12-08 2019-06-12 Activa Awning Inc. Appareil d'auvent

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3428059A (en) * 1967-04-03 1969-02-18 Geoscience Instr Corp Rotary basket processing apparatus
DE1915714C3 (de) * 1969-03-27 1975-07-10 Robert Bosch Gmbh, 7000 Stuttgart Vorrichtung zum Xtzen von Halbleiterscheiben mit einem mit Ätzflüssigkeit gefüllten Gefäß und einem in die Ätzflüssigkeit eingetauchten, mit waagrechter Achse rotierenden Ätzkorb
US3841689A (en) * 1973-06-29 1974-10-15 Bell Telephone Labor Inc Semiconductor wafer transfer fixture

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NEANT *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2597368A1 (fr) * 1986-04-17 1987-10-23 Guilbaud Jean Pierre Dispositif pour le traitement de produits divers par immersion dans des liquides puis essorage.
EP0497104A1 (fr) * 1991-02-01 1992-08-05 Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH Magasin pour contenir des pièces en forme de disques, en particulier des disques semi-conducteurs, dans un traitement de surface chimique en bains liquides
FR2698639A1 (fr) * 1992-12-01 1994-06-03 Sgs Thomson Microelectronics Machine de gravure chimique de silicium.

Also Published As

Publication number Publication date
DE2557367A1 (de) 1976-06-24
FR2295567B1 (fr) 1979-04-27
JPS5186367A (en) 1976-07-28
US3977926A (en) 1976-08-31
US4077416A (en) 1978-03-07
GB1486709A (en) 1977-09-21
CA1038503A (fr) 1978-09-12

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Legal Events

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ST Notification of lapse