JPS5129086A - Riidofureemu - Google Patents

Riidofureemu

Info

Publication number
JPS5129086A
JPS5129086A JP10208574A JP10208574A JPS5129086A JP S5129086 A JPS5129086 A JP S5129086A JP 10208574 A JP10208574 A JP 10208574A JP 10208574 A JP10208574 A JP 10208574A JP S5129086 A JPS5129086 A JP S5129086A
Authority
JP
Japan
Prior art keywords
riidofureemu
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10208574A
Other languages
English (en)
Other versions
JPS5748858B2 (ja
Inventor
Sadao Ogura
Kazuo Hoya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10208574A priority Critical patent/JPS5129086A/ja
Publication of JPS5129086A publication Critical patent/JPS5129086A/ja
Publication of JPS5748858B2 publication Critical patent/JPS5748858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP10208574A 1974-09-06 1974-09-06 Riidofureemu Granted JPS5129086A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10208574A JPS5129086A (ja) 1974-09-06 1974-09-06 Riidofureemu

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10208574A JPS5129086A (ja) 1974-09-06 1974-09-06 Riidofureemu

Related Child Applications (5)

Application Number Title Priority Date Filing Date
JP16961080A Division JPS56107568A (en) 1980-12-03 1980-12-03 Resin sealing method for semiconductor device
JP16961180A Division JPS56107566A (en) 1980-12-03 1980-12-03 Resin sealing method for semiconductor device
JP56174578A Division JPS57103340A (en) 1981-11-02 1981-11-02 Resin sealing method for semiconductor device and lead frame used therefor
JP56174579A Division JPS57103341A (en) 1981-11-02 1981-11-02 Resin sealed semiconductor device
JP58120363A Division JPS5941861A (ja) 1983-07-04 1983-07-04 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS5129086A true JPS5129086A (ja) 1976-03-11
JPS5748858B2 JPS5748858B2 (ja) 1982-10-19

Family

ID=14317922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10208574A Granted JPS5129086A (ja) 1974-09-06 1974-09-06 Riidofureemu

Country Status (1)

Country Link
JP (1) JPS5129086A (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521124A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame
JPS5571051A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Semiconductor device
JPS579859A (en) * 1980-06-17 1982-01-19 Toshiba Corp Corrosion-resistant material
JPS57205296A (en) * 1981-06-15 1982-12-16 Toshiba Corp Propeller for ship and production thereof
JPS58170834U (ja) * 1982-05-07 1983-11-15 日本電気株式会社 リ−ドフレ−ムのアイランド吊り構造
JPS6163047A (ja) * 1985-06-28 1986-04-01 Hitachi Ltd 樹脂封止型形半導体装置用リ−ドフレ−ム
JPH03180448A (ja) * 1989-12-11 1991-08-06 Kawasaki Steel Corp 腐食ないし侵食環境における耐疲労特性に優れる高強度マルテンサイトステンレス圧延鋼板
US5599408A (en) * 1992-09-04 1997-02-04 Mitsubishi Jukogyo Kabushiki Kaisha Method of producing a structural member

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4958761A (ja) * 1972-10-04 1974-06-07
JPS4964373A (ja) * 1972-06-23 1974-06-21

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4964373A (ja) * 1972-06-23 1974-06-21
JPS4958761A (ja) * 1972-10-04 1974-06-07

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521124A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame
JPS6217381B2 (ja) * 1978-08-02 1987-04-17 Hitachi Ltd
JPS5571051A (en) * 1978-11-24 1980-05-28 Hitachi Ltd Semiconductor device
JPS6155770B2 (ja) * 1978-11-24 1986-11-29 Hitachi Ltd
JPS579859A (en) * 1980-06-17 1982-01-19 Toshiba Corp Corrosion-resistant material
JPS633947B2 (ja) * 1980-06-17 1988-01-26 Tokyo Shibaura Electric Co
JPS57205296A (en) * 1981-06-15 1982-12-16 Toshiba Corp Propeller for ship and production thereof
JPS58170834U (ja) * 1982-05-07 1983-11-15 日本電気株式会社 リ−ドフレ−ムのアイランド吊り構造
JPS638144Y2 (ja) * 1982-05-07 1988-03-10
JPS6163047A (ja) * 1985-06-28 1986-04-01 Hitachi Ltd 樹脂封止型形半導体装置用リ−ドフレ−ム
JPH03180448A (ja) * 1989-12-11 1991-08-06 Kawasaki Steel Corp 腐食ないし侵食環境における耐疲労特性に優れる高強度マルテンサイトステンレス圧延鋼板
US5599408A (en) * 1992-09-04 1997-02-04 Mitsubishi Jukogyo Kabushiki Kaisha Method of producing a structural member

Also Published As

Publication number Publication date
JPS5748858B2 (ja) 1982-10-19

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