JPS5119475A - Ionuchikomikibanno seizohoho - Google Patents

Ionuchikomikibanno seizohoho

Info

Publication number
JPS5119475A
JPS5119475A JP50075745A JP7574575A JPS5119475A JP S5119475 A JPS5119475 A JP S5119475A JP 50075745 A JP50075745 A JP 50075745A JP 7574575 A JP7574575 A JP 7574575A JP S5119475 A JPS5119475 A JP S5119475A
Authority
JP
Japan
Prior art keywords
ionuchikomikibanno
seizohoho
ionuchikomikibanno seizohoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50075745A
Other languages
English (en)
Other versions
JPS5238385B2 (ja
Inventor
Jii Keiniigu Uirufuriido
Esu Makurisu Jeemuzu
Jei Masutaazu Baaton
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5119475A publication Critical patent/JPS5119475A/ja
Publication of JPS5238385B2 publication Critical patent/JPS5238385B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
    • H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
    • H01L21/2652—Through-implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/74—Making of localized buried regions, e.g. buried collector layers, internal connections substrate contacts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/007—Autodoping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/037—Diffusion-deposition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/06—Gettering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/145—Shaped junctions

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Element Separation (AREA)
  • Bipolar Transistors (AREA)
  • Drying Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
JP50075745A 1974-07-15 1975-06-23 Ionuchikomikibanno seizohoho Granted JPS5119475A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/488,376 US3945856A (en) 1974-07-15 1974-07-15 Method of ion implantation through an electrically insulative material

Publications (2)

Publication Number Publication Date
JPS5119475A true JPS5119475A (en) 1976-02-16
JPS5238385B2 JPS5238385B2 (ja) 1977-09-28

Family

ID=23939499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50075745A Granted JPS5119475A (en) 1974-07-15 1975-06-23 Ionuchikomikibanno seizohoho

Country Status (11)

Country Link
US (1) US3945856A (ja)
JP (1) JPS5119475A (ja)
BR (1) BR7504456A (ja)
CA (1) CA1034683A (ja)
CH (1) CH594987A5 (ja)
DE (1) DE2531003B2 (ja)
FR (1) FR2279223A1 (ja)
GB (1) GB1457223A (ja)
IT (1) IT1038940B (ja)
NL (1) NL7507742A (ja)
SE (1) SE404975B (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56101757A (en) * 1980-01-18 1981-08-14 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS6066814A (ja) * 1983-09-16 1985-04-17 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体デバイスの製造方法
JPS60134478A (ja) * 1983-11-28 1985-07-17 ローム・コーポレーション 電気的プログラム式記憶装置を製造する方法
JPS60249319A (ja) * 1984-05-24 1985-12-10 Mitsubishi Electric Corp 半導体装置の製造方法
JP2007142134A (ja) * 2005-11-18 2007-06-07 Sumco Corp Ｓｏｉ基板の製造方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4243435A (en) * 1979-06-22 1981-01-06 International Business Machines Corporation Bipolar transistor fabrication process with an ion implanted emitter
CA1131797A (en) * 1979-08-20 1982-09-14 Jagir S. Multani Fabrication of a semiconductor device in a simulated epitaxial layer
US4507159A (en) * 1981-10-07 1985-03-26 Advanced Micro Devices, Inc. Method of manufacturing high capacity semiconductor capacitance devices
JPS6215864A (ja) * 1985-07-15 1987-01-24 Hitachi Ltd 太陽電池の製造方法
US5021358A (en) * 1987-05-14 1991-06-04 North American Philips Corp. Signetics Division Semiconductor fabrication process using sacrificial oxidation to reduce tunnel formation during tungsten deposition
US5026437A (en) * 1990-01-22 1991-06-25 Tencor Instruments Cantilevered microtip manufacturing by ion implantation and etching
US5244819A (en) * 1991-10-22 1993-09-14 Honeywell Inc. Method to getter contamination in semiconductor devices
US5316981A (en) * 1992-10-09 1994-05-31 Advanced Micro Devices, Inc. Method for achieving a high quality thin oxide using a sacrificial oxide anneal
US5362685A (en) * 1992-10-29 1994-11-08 Advanced Micro Devices, Inc. Method for achieving a high quality thin oxide in integrated circuit devices
US5498577A (en) * 1994-07-26 1996-03-12 Advanced Micro Devices, Inc. Method for fabricating thin oxides for a semiconductor technology
US5525529A (en) * 1994-11-16 1996-06-11 Texas Instruments Incorporated Method for reducing dopant diffusion
CN113611600A (zh) * 2021-07-29 2021-11-05 上海华力微电子有限公司 半导体器件的制备方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3388009A (en) * 1965-06-23 1968-06-11 Ion Physics Corp Method of forming a p-n junction by an ionic beam
GB1209914A (en) * 1967-03-29 1970-10-21 Marconi Co Ltd Improvements in or relating to semi-conductor devices
US3632438A (en) * 1967-09-29 1972-01-04 Texas Instruments Inc Method for increasing the stability of semiconductor devices
US3566519A (en) * 1968-04-01 1971-03-02 Sprague Electric Co Method of making field effect transistor device
US3704178A (en) * 1969-11-05 1972-11-28 Bryan H Hill Process for forming a p-n junction in a semiconductor material
US3717790A (en) * 1971-06-24 1973-02-20 Bell Telephone Labor Inc Ion implanted silicon diode array targets for electron beam camera tubes
US3793088A (en) * 1972-11-15 1974-02-19 Bell Telephone Labor Inc Compatible pnp and npn devices in an integrated circuit

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56101757A (en) * 1980-01-18 1981-08-14 Mitsubishi Electric Corp Manufacture of semiconductor device
JPS6066814A (ja) * 1983-09-16 1985-04-17 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体デバイスの製造方法
JPS60134478A (ja) * 1983-11-28 1985-07-17 ローム・コーポレーション 電気的プログラム式記憶装置を製造する方法
JPH0574947B2 (ja) * 1983-11-28 1993-10-19 Roomu Corp
JPS60249319A (ja) * 1984-05-24 1985-12-10 Mitsubishi Electric Corp 半導体装置の製造方法
JP2007142134A (ja) * 2005-11-18 2007-06-07 Sumco Corp Ｓｏｉ基板の製造方法

Also Published As

Publication number Publication date
IT1038940B (it) 1979-11-30
SE7507114L (sv) 1976-01-16
US3945856A (en) 1976-03-23
FR2279223B1 (ja) 1979-04-27
JPS5238385B2 (ja) 1977-09-28
DE2531003B2 (de) 1977-02-17
DE2531003A1 (de) 1976-02-05
FR2279223A1 (fr) 1976-02-13
GB1457223A (en) 1976-12-01
AU8258175A (en) 1977-01-06
SE404975B (sv) 1978-11-06
CA1034683A (en) 1978-07-11
BR7504456A (pt) 1976-07-06
NL7507742A (nl) 1976-01-19
CH594987A5 (ja) 1978-01-31

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