JPS51150671A - Method of fixing electronic parts - Google Patents

Method of fixing electronic parts

Info

Publication number
JPS51150671A
JPS51150671A JP50075271A JP7527175A JPS51150671A JP S51150671 A JPS51150671 A JP S51150671A JP 50075271 A JP50075271 A JP 50075271A JP 7527175 A JP7527175 A JP 7527175A JP S51150671 A JPS51150671 A JP S51150671A
Authority
JP
Japan
Prior art keywords
electronic parts
fixing electronic
fixing
parts
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50075271A
Other languages
Japanese (ja)
Other versions
JPS5928996B2 (en
Inventor
Yukihiro Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP50075271A priority Critical patent/JPS5928996B2/en
Publication of JPS51150671A publication Critical patent/JPS51150671A/en
Publication of JPS5928996B2 publication Critical patent/JPS5928996B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
JP50075271A 1975-06-19 1975-06-19 How to install electronic parts Expired JPS5928996B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50075271A JPS5928996B2 (en) 1975-06-19 1975-06-19 How to install electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50075271A JPS5928996B2 (en) 1975-06-19 1975-06-19 How to install electronic parts

Publications (2)

Publication Number Publication Date
JPS51150671A true JPS51150671A (en) 1976-12-24
JPS5928996B2 JPS5928996B2 (en) 1984-07-17

Family

ID=13571388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50075271A Expired JPS5928996B2 (en) 1975-06-19 1975-06-19 How to install electronic parts

Country Status (1)

Country Link
JP (1) JPS5928996B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138897A (en) * 1979-04-17 1980-10-30 Matsushita Electric Ind Co Ltd Device for mounting leadless component to printed circuit board
JPS59117188A (en) * 1982-12-24 1984-07-06 株式会社日立製作所 Method of constructing circuit board
JPH0237735A (en) * 1988-07-27 1990-02-07 Semiconductor Energy Lab Co Ltd Mounting structure of semiconductor chip
WO1997003460A1 (en) * 1995-07-12 1997-01-30 Hoya Corporation Bare chip mounted board, method of manufacturing the board, and method of forming electrode of bare chip

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4857652U (en) * 1971-11-02 1973-07-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4857652U (en) * 1971-11-02 1973-07-23

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55138897A (en) * 1979-04-17 1980-10-30 Matsushita Electric Ind Co Ltd Device for mounting leadless component to printed circuit board
JPS59117188A (en) * 1982-12-24 1984-07-06 株式会社日立製作所 Method of constructing circuit board
JPH0416941B2 (en) * 1982-12-24 1992-03-25 Hitachi Ltd
JPH0237735A (en) * 1988-07-27 1990-02-07 Semiconductor Energy Lab Co Ltd Mounting structure of semiconductor chip
WO1997003460A1 (en) * 1995-07-12 1997-01-30 Hoya Corporation Bare chip mounted board, method of manufacturing the board, and method of forming electrode of bare chip

Also Published As

Publication number Publication date
JPS5928996B2 (en) 1984-07-17

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