JPS51150672A - Method of fixing electronic parts - Google Patents

Method of fixing electronic parts

Info

Publication number
JPS51150672A
JPS51150672A JP50075272A JP7527275A JPS51150672A JP S51150672 A JPS51150672 A JP S51150672A JP 50075272 A JP50075272 A JP 50075272A JP 7527275 A JP7527275 A JP 7527275A JP S51150672 A JPS51150672 A JP S51150672A
Authority
JP
Japan
Prior art keywords
electronic parts
fixing electronic
fixing
parts
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50075272A
Other languages
Japanese (ja)
Inventor
Yukihiro Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP50075272A priority Critical patent/JPS51150672A/en
Publication of JPS51150672A publication Critical patent/JPS51150672A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP50075272A 1975-06-19 1975-06-19 Method of fixing electronic parts Pending JPS51150672A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50075272A JPS51150672A (en) 1975-06-19 1975-06-19 Method of fixing electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50075272A JPS51150672A (en) 1975-06-19 1975-06-19 Method of fixing electronic parts

Publications (1)

Publication Number Publication Date
JPS51150672A true JPS51150672A (en) 1976-12-24

Family

ID=13571418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50075272A Pending JPS51150672A (en) 1975-06-19 1975-06-19 Method of fixing electronic parts

Country Status (1)

Country Link
JP (1) JPS51150672A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5828848A (en) * 1981-05-06 1983-02-19 アイ・テイ・テイ・インダストリ−ズ・インコ−ポレ−テツド Integrated circuit, semiconductor device and method of mounting component
JPS62204371U (en) * 1986-06-18 1987-12-26
JPH02217240A (en) * 1989-02-20 1990-08-30 Matsushita Electric Works Ltd Surface mounting laminated sheet

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5828848A (en) * 1981-05-06 1983-02-19 アイ・テイ・テイ・インダストリ−ズ・インコ−ポレ−テツド Integrated circuit, semiconductor device and method of mounting component
JPS62204371U (en) * 1986-06-18 1987-12-26
JPH02217240A (en) * 1989-02-20 1990-08-30 Matsushita Electric Works Ltd Surface mounting laminated sheet

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