JPS51144180A - Resin sealing method of semiconductor unit - Google Patents

Resin sealing method of semiconductor unit

Info

Publication number
JPS51144180A
JPS51144180A JP6750275A JP6750275A JPS51144180A JP S51144180 A JPS51144180 A JP S51144180A JP 6750275 A JP6750275 A JP 6750275A JP 6750275 A JP6750275 A JP 6750275A JP S51144180 A JPS51144180 A JP S51144180A
Authority
JP
Japan
Prior art keywords
resin sealing
sealing method
semiconductor unit
bringing
proof
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6750275A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5716743B2 (enExample
Inventor
Yoichi Matsuda
Masanori Segawa
Hiroshi Suzuki
Masahiro Kitamura
Junji Mukai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6750275A priority Critical patent/JPS51144180A/ja
Publication of JPS51144180A publication Critical patent/JPS51144180A/ja
Publication of JPS5716743B2 publication Critical patent/JPS5716743B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP6750275A 1975-06-06 1975-06-06 Resin sealing method of semiconductor unit Granted JPS51144180A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6750275A JPS51144180A (en) 1975-06-06 1975-06-06 Resin sealing method of semiconductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6750275A JPS51144180A (en) 1975-06-06 1975-06-06 Resin sealing method of semiconductor unit

Publications (2)

Publication Number Publication Date
JPS51144180A true JPS51144180A (en) 1976-12-10
JPS5716743B2 JPS5716743B2 (enExample) 1982-04-07

Family

ID=13346816

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6750275A Granted JPS51144180A (en) 1975-06-06 1975-06-06 Resin sealing method of semiconductor unit

Country Status (1)

Country Link
JP (1) JPS51144180A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627143A (ja) * 1985-07-04 1987-01-14 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS627143A (ja) * 1985-07-04 1987-01-14 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料

Also Published As

Publication number Publication date
JPS5716743B2 (enExample) 1982-04-07

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