JPS51143885A - Bonding method for fine wires - Google Patents
Bonding method for fine wiresInfo
- Publication number
- JPS51143885A JPS51143885A JP6763675A JP6763675A JPS51143885A JP S51143885 A JPS51143885 A JP S51143885A JP 6763675 A JP6763675 A JP 6763675A JP 6763675 A JP6763675 A JP 6763675A JP S51143885 A JPS51143885 A JP S51143885A
- Authority
- JP
- Japan
- Prior art keywords
- bonding method
- fine wires
- bonding
- terminal
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6763675A JPS51143885A (en) | 1975-06-06 | 1975-06-06 | Bonding method for fine wires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6763675A JPS51143885A (en) | 1975-06-06 | 1975-06-06 | Bonding method for fine wires |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51143885A true JPS51143885A (en) | 1976-12-10 |
| JPS5713113B2 JPS5713113B2 (cg-RX-API-DMAC7.html) | 1982-03-15 |
Family
ID=13350666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6763675A Granted JPS51143885A (en) | 1975-06-06 | 1975-06-06 | Bonding method for fine wires |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51143885A (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57153419A (en) * | 1981-03-18 | 1982-09-22 | Toshiba Corp | Laser welding method |
-
1975
- 1975-06-06 JP JP6763675A patent/JPS51143885A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57153419A (en) * | 1981-03-18 | 1982-09-22 | Toshiba Corp | Laser welding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5713113B2 (cg-RX-API-DMAC7.html) | 1982-03-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS51143885A (en) | Bonding method for fine wires | |
| JPS5419652A (en) | Lead bonding method | |
| JPS5439343A (en) | Bonding method | |
| JPS52172A (en) | Semiconductor | |
| JPS529414A (en) | Production method of magnetic head | |
| JPS51126063A (en) | Wire bonding method | |
| JPS524082A (en) | Preparation method of a colored insulated wire | |
| JPS5229904A (en) | Stator for electromagnetic machine | |
| JPS5348461A (en) | Wire bonder | |
| JPS5252490A (en) | Welding method and apparatus for lamp lead wire | |
| JPS5310968A (en) | Pellet bonding method | |
| JPS5279657A (en) | Wire bonding device | |
| JPS5279659A (en) | Semiconductor device | |
| JPS52126787A (en) | Connecting method of lead wire | |
| JPS5232264A (en) | Formation method for solder electrode | |
| JPS51151070A (en) | Connection method of a semiconductor apparatus | |
| JPS51149584A (en) | Connecting method of a terminal | |
| JPS5375763A (en) | Manufacture for semiconductor device | |
| JPS5364468A (en) | Silver wire connecting method | |
| JPS51115774A (en) | Electrically bonding method | |
| JPS522167A (en) | Wire bonding method | |
| JPS51126061A (en) | Wire bonding method | |
| JPS5273675A (en) | Structure of die bonding | |
| JPS51126059A (en) | Construction method of semi-conductor equipment | |
| JPS5240065A (en) | Lead frame |