JPS51141580A - Method for drawing a lead wire of a semiconductor element - Google Patents
Method for drawing a lead wire of a semiconductor elementInfo
- Publication number
- JPS51141580A JPS51141580A JP50064840A JP6484075A JPS51141580A JP S51141580 A JPS51141580 A JP S51141580A JP 50064840 A JP50064840 A JP 50064840A JP 6484075 A JP6484075 A JP 6484075A JP S51141580 A JPS51141580 A JP S51141580A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead wire
- tip
- electrode
- rubbing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Semiconductor Lasers (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50064840A JPS51141580A (en) | 1975-05-31 | 1975-05-31 | Method for drawing a lead wire of a semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50064840A JPS51141580A (en) | 1975-05-31 | 1975-05-31 | Method for drawing a lead wire of a semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51141580A true JPS51141580A (en) | 1976-12-06 |
| JPS5724650B2 JPS5724650B2 (enExample) | 1982-05-25 |
Family
ID=13269819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50064840A Granted JPS51141580A (en) | 1975-05-31 | 1975-05-31 | Method for drawing a lead wire of a semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51141580A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05346991A (ja) * | 1992-06-15 | 1993-12-27 | Tokyo Electric Co Ltd | 商品販売データ処理装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4720197U (enExample) * | 1971-02-17 | 1972-11-07 |
-
1975
- 1975-05-31 JP JP50064840A patent/JPS51141580A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4720197U (enExample) * | 1971-02-17 | 1972-11-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5724650B2 (enExample) | 1982-05-25 |
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