JPS51141580A - Method for drawing a lead wire of a semiconductor element - Google Patents
Method for drawing a lead wire of a semiconductor elementInfo
- Publication number
- JPS51141580A JPS51141580A JP50064840A JP6484075A JPS51141580A JP S51141580 A JPS51141580 A JP S51141580A JP 50064840 A JP50064840 A JP 50064840A JP 6484075 A JP6484075 A JP 6484075A JP S51141580 A JPS51141580 A JP S51141580A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- lead wire
- tip
- electrode
- rubbing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Semiconductor Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50064840A JPS51141580A (en) | 1975-05-31 | 1975-05-31 | Method for drawing a lead wire of a semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50064840A JPS51141580A (en) | 1975-05-31 | 1975-05-31 | Method for drawing a lead wire of a semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51141580A true JPS51141580A (en) | 1976-12-06 |
| JPS5724650B2 JPS5724650B2 (cg-RX-API-DMAC10.html) | 1982-05-25 |
Family
ID=13269819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50064840A Granted JPS51141580A (en) | 1975-05-31 | 1975-05-31 | Method for drawing a lead wire of a semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51141580A (cg-RX-API-DMAC10.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05346991A (ja) * | 1992-06-15 | 1993-12-27 | Tokyo Electric Co Ltd | 商品販売データ処理装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4720197U (cg-RX-API-DMAC10.html) * | 1971-02-17 | 1972-11-07 |
-
1975
- 1975-05-31 JP JP50064840A patent/JPS51141580A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4720197U (cg-RX-API-DMAC10.html) * | 1971-02-17 | 1972-11-07 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5724650B2 (cg-RX-API-DMAC10.html) | 1982-05-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS51131274A (en) | Tip bonding method | |
| JPS5239378A (en) | Silicon-gated mos type semiconductor device | |
| JPS51141580A (en) | Method for drawing a lead wire of a semiconductor element | |
| JPS51126063A (en) | Wire bonding method | |
| JPS533165A (en) | Wire bonding apparatus | |
| JPS51151069A (en) | Electrode forming method of a semiconductor element | |
| JPS5210091A (en) | Mounting method of radiation detector element | |
| JPS5585035A (en) | Bonding method and apparatus used therefor | |
| JPS5416979A (en) | Production of semiconuctor device | |
| JPS524084A (en) | Cord end molding method | |
| JPS5228262A (en) | Process for assembling semiconductor device | |
| JPS5396759A (en) | Production of semiconductor device | |
| JPS53140967A (en) | Production of electrodes of semiconductor device | |
| JPS5324779A (en) | Clamper of wire bonder | |
| JPS5324268A (en) | Pro duction of semiconductor device and bonding wire for the same | |
| JPS547869A (en) | Lead bending method of semiconductor device | |
| JPS5279657A (en) | Wire bonding device | |
| JPS5360572A (en) | Ultrasonic wire bonding device | |
| JPS5244566A (en) | Method of alloying semiconductor pellet | |
| JPS51126062A (en) | Tap short bonding method on wire bonding | |
| JPS5230467A (en) | Method of fixing clockface window frame | |
| JPS5242678A (en) | Method for welding lead wires of bulb | |
| JPS51149584A (en) | Connecting method of a terminal | |
| JPS53135573A (en) | Wire bonding method of semiconductor element | |
| JPS5333060A (en) | Electrode lead-out method |