JPS51140569A - Method for mutually connecting semiconductor pellets to ceramics distr ibuting base plate - Google Patents

Method for mutually connecting semiconductor pellets to ceramics distr ibuting base plate

Info

Publication number
JPS51140569A
JPS51140569A JP6431175A JP6431175A JPS51140569A JP S51140569 A JPS51140569 A JP S51140569A JP 6431175 A JP6431175 A JP 6431175A JP 6431175 A JP6431175 A JP 6431175A JP S51140569 A JPS51140569 A JP S51140569A
Authority
JP
Japan
Prior art keywords
base plate
ceramics
ibuting
distr
mutually connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6431175A
Other languages
Japanese (ja)
Inventor
Hisashi Yoshida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6431175A priority Critical patent/JPS51140569A/en
Publication of JPS51140569A publication Critical patent/JPS51140569A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To facilitate the mutual connection of a semiconductor pellet and a ceramics wire-distributing base plate.
COPYRIGHT: (C)1976,JPO&Japio
JP6431175A 1975-05-30 1975-05-30 Method for mutually connecting semiconductor pellets to ceramics distr ibuting base plate Pending JPS51140569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6431175A JPS51140569A (en) 1975-05-30 1975-05-30 Method for mutually connecting semiconductor pellets to ceramics distr ibuting base plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6431175A JPS51140569A (en) 1975-05-30 1975-05-30 Method for mutually connecting semiconductor pellets to ceramics distr ibuting base plate

Publications (1)

Publication Number Publication Date
JPS51140569A true JPS51140569A (en) 1976-12-03

Family

ID=13254552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6431175A Pending JPS51140569A (en) 1975-05-30 1975-05-30 Method for mutually connecting semiconductor pellets to ceramics distr ibuting base plate

Country Status (1)

Country Link
JP (1) JPS51140569A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02102523A (en) * 1988-10-11 1990-04-16 Nec Corp Wafer boat

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02102523A (en) * 1988-10-11 1990-04-16 Nec Corp Wafer boat

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