Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric CorpfiledCriticalMitsubishi Electric Corp
Priority to JP5904175ApriorityCriticalpatent/JPS51134571A/en
Publication of JPS51134571ApublicationCriticalpatent/JPS51134571A/en
Publication of JPS5756777B2publicationCriticalpatent/JPS5756777B2/ja
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices
(AREA)
Abstract
PURPOSE: To save the material by utilizing support base material efficiently and producing no scrap in resin mold type semi-conductor unit manufacturing process.
COPYRIGHT: (C)1976,JPO&Japio
JP5904175A1975-05-161975-05-16Semiconductor unit manufacturing process
GrantedJPS51134571A
(en)