JPS51124681A - A method of rf supttering - Google Patents
A method of rf suptteringInfo
- Publication number
- JPS51124681A JPS51124681A JP4907875A JP4907875A JPS51124681A JP S51124681 A JPS51124681 A JP S51124681A JP 4907875 A JP4907875 A JP 4907875A JP 4907875 A JP4907875 A JP 4907875A JP S51124681 A JPS51124681 A JP S51124681A
- Authority
- JP
- Japan
- Prior art keywords
- supttering
- vacuum
- film
- thin
- sputtering method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000009413 insulation Methods 0.000 abstract 1
- 238000001552 radio frequency sputter deposition Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
- C23C14/025—Metallic sublayers
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4907875A JPS51124681A (en) | 1975-04-24 | 1975-04-24 | A method of rf supttering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4907875A JPS51124681A (en) | 1975-04-24 | 1975-04-24 | A method of rf supttering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51124681A true JPS51124681A (en) | 1976-10-30 |
| JPS551983B2 JPS551983B2 (en:Method) | 1980-01-17 |
Family
ID=12821042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4907875A Granted JPS51124681A (en) | 1975-04-24 | 1975-04-24 | A method of rf supttering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS51124681A (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01257397A (ja) * | 1988-04-07 | 1989-10-13 | Mitsubishi Heavy Ind Ltd | 金属プリント基板 |
-
1975
- 1975-04-24 JP JP4907875A patent/JPS51124681A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01257397A (ja) * | 1988-04-07 | 1989-10-13 | Mitsubishi Heavy Ind Ltd | 金属プリント基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS551983B2 (en:Method) | 1980-01-17 |
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