JPS51112274A - A metal tape used in electronic part and electronic part production me thod - Google Patents

A metal tape used in electronic part and electronic part production me thod

Info

Publication number
JPS51112274A
JPS51112274A JP50036794A JP3679475A JPS51112274A JP S51112274 A JPS51112274 A JP S51112274A JP 50036794 A JP50036794 A JP 50036794A JP 3679475 A JP3679475 A JP 3679475A JP S51112274 A JPS51112274 A JP S51112274A
Authority
JP
Japan
Prior art keywords
electronic part
metal tape
tape used
thod
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50036794A
Other languages
Japanese (ja)
Other versions
JPS5547455B2 (en
Inventor
Hiroshi Maejima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50036794A priority Critical patent/JPS51112274A/en
Priority to NL7602074A priority patent/NL7602074A/en
Priority to DE19762608175 priority patent/DE2608175A1/en
Publication of JPS51112274A publication Critical patent/JPS51112274A/en
Publication of JPS5547455B2 publication Critical patent/JPS5547455B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/481—Disposition
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    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/19043—Component type being a resistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain a low cost metal tape used in producing electronic parts such as a semiconductor and resistor which can withstand heat upon processing and has a low coefficient of thermal expansion.
COPYRIGHT: (C)1976,JPO&Japio
JP50036794A 1975-03-28 1975-03-28 A metal tape used in electronic part and electronic part production me thod Granted JPS51112274A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP50036794A JPS51112274A (en) 1975-03-28 1975-03-28 A metal tape used in electronic part and electronic part production me thod
NL7602074A NL7602074A (en) 1975-03-28 1976-02-27 ELECTRICAL CHAIN DEVICE, METHOD FOR MOUNTING THEREOF, AND METAL STRAP FOR USE IN THE PROCEDURE.
DE19762608175 DE2608175A1 (en) 1975-03-28 1976-02-27 Productn of electronic components in strips - using metal base to increase precision of assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50036794A JPS51112274A (en) 1975-03-28 1975-03-28 A metal tape used in electronic part and electronic part production me thod

Publications (2)

Publication Number Publication Date
JPS51112274A true JPS51112274A (en) 1976-10-04
JPS5547455B2 JPS5547455B2 (en) 1980-11-29

Family

ID=12479682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50036794A Granted JPS51112274A (en) 1975-03-28 1975-03-28 A metal tape used in electronic part and electronic part production me thod

Country Status (3)

Country Link
JP (1) JPS51112274A (en)
DE (1) DE2608175A1 (en)
NL (1) NL7602074A (en)

Also Published As

Publication number Publication date
NL7602074A (en) 1976-09-30
JPS5547455B2 (en) 1980-11-29
DE2608175A1 (en) 1976-10-14

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