JPS5062773A - - Google Patents

Info

Publication number
JPS5062773A
JPS5062773A JP49113361A JP11336174A JPS5062773A JP S5062773 A JPS5062773 A JP S5062773A JP 49113361 A JP49113361 A JP 49113361A JP 11336174 A JP11336174 A JP 11336174A JP S5062773 A JPS5062773 A JP S5062773A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49113361A
Other versions
JPS6052588B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5062773A publication Critical patent/JPS5062773A/ja
Publication of JPS6052588B2 publication Critical patent/JPS6052588B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5116—Ag or Au
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/069—Green sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49799—Providing transitory integral holding or handling portion

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP49113361A 1973-10-04 1974-10-03 セラミツク基板の均一金メツキ処理法 Expired JPS6052588B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US403404 1973-10-04
US403404A US3926746A (en) 1973-10-04 1973-10-04 Electrical interconnection for metallized ceramic arrays

Publications (2)

Publication Number Publication Date
JPS5062773A true JPS5062773A (ja) 1975-05-28
JPS6052588B2 JPS6052588B2 (ja) 1985-11-20

Family

ID=23595639

Family Applications (1)

Application Number Title Priority Date Filing Date
JP49113361A Expired JPS6052588B2 (ja) 1973-10-04 1974-10-03 セラミツク基板の均一金メツキ処理法

Country Status (4)

Country Link
US (1) US3926746A (ja)
JP (1) JPS6052588B2 (ja)
DE (1) DE2447284A1 (ja)
GB (1) GB1482012A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024093A (ja) * 1984-06-04 1985-02-06 株式会社日立製作所 セラミツク配線基板の製造法
JPS6212189A (ja) * 1985-07-09 1987-01-21 日立エーアイシー株式会社 プリント配線板の製造方法

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS563921Y2 (ja) * 1976-01-19 1981-01-28
JPS563922Y2 (ja) * 1976-01-19 1981-01-28
NL7605233A (nl) * 1976-05-17 1977-11-21 Philips Nv Van een micro circuit voorziene elementaire schijf met electrolytisch aangegroeide soldeerbollen alsmede werkwijze voor het vervaardigen daarvan.
US4134801A (en) * 1976-05-17 1979-01-16 U.S. Philips Corporation Terminal connections on microcircuit chips
JPS5382170A (en) * 1976-12-28 1978-07-20 Ngk Insulators Ltd Method of producing coupled type ic ceramic package
US4216523A (en) * 1977-12-02 1980-08-05 Rca Corporation Modular printed circuit board
US4243729A (en) * 1978-07-31 1981-01-06 Semi-Alloys, Inc. Metallic hermetic sealing cover for a container
JPS5521128A (en) * 1978-08-02 1980-02-15 Hitachi Ltd Lead frame used for semiconductor device and its assembling
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4975762A (en) * 1981-06-11 1990-12-04 General Electric Ceramics, Inc. Alpha-particle-emitting ceramic composite cover
DE3303165C2 (de) * 1982-02-05 1993-12-09 Hitachi Ltd Halbleitervorrichtung mit Gehäusekörper und Verbindungsleitern
US4681656A (en) * 1983-02-22 1987-07-21 Byrum James E IC carrier system
US4572757A (en) * 1984-01-23 1986-02-25 The Jade Corporation Method of making a microcircuit substrate
IL78192A (en) * 1985-04-12 1992-03-29 Hughes Aircraft Co Mini chip carrier slotted array
US4802277A (en) * 1985-04-12 1989-02-07 Hughes Aircraft Company Method of making a chip carrier slotted array
US4762606A (en) * 1985-04-12 1988-08-09 Hughes Aircraft Company Mini chip carrier slotted array
US4659931A (en) * 1985-05-08 1987-04-21 Grumman Aerospace Corporation High density multi-layered integrated circuit package
US4753820A (en) * 1986-10-20 1988-06-28 United Technologies Corporation Variable pitch IC bond pad arrangement
GB2223354B (en) * 1988-09-30 1992-10-14 Marconi Electronic Devices Semiconductor devices
EP0496491A1 (en) * 1991-01-22 1992-07-29 National Semiconductor Corporation Leadless chip resistor capacitor carrier for hybrid circuits and a method of making the same
US5337216A (en) * 1992-05-18 1994-08-09 Square D Company Multichip semiconductor small outline integrated circuit package structure
US5319521A (en) * 1992-08-17 1994-06-07 Rockwell International Corporation Ceramic frames and capsules for Z-axis modules
JP3008146B2 (ja) * 1992-10-26 2000-02-14 株式会社住友金属エレクトロデバイス 半導体素子収納用セラミックパッケージとその製造方法
US5314606A (en) * 1993-02-16 1994-05-24 Kyocera America, Inc. Leadless ceramic package with improved solderabilty
DE4319944C2 (de) * 1993-06-03 1998-07-23 Schulz Harder Juergen Mehrfach-Substrat sowie Verfahren zu seiner Herstellung
JPH07240479A (ja) * 1993-09-21 1995-09-12 Texas Instr Inc <Ti> 集積回路パッケージ化の方法およびパッケージ
US5583378A (en) * 1994-05-16 1996-12-10 Amkor Electronics, Inc. Ball grid array integrated circuit package with thermal conductor
JP3541491B2 (ja) * 1994-06-22 2004-07-14 セイコーエプソン株式会社 電子部品
US5832600A (en) * 1995-06-06 1998-11-10 Seiko Epson Corporation Method of mounting electronic parts
US5880011A (en) * 1996-06-19 1999-03-09 Pacific Trinetics Corporation Method and apparatus for manufacturing pre-terminated chips
DE19910078A1 (de) * 1999-03-08 2000-09-28 Bosch Gmbh Robert Verfahren zur Erhöung der Fertigungssicherheit von Lötverbindungen
US6248964B1 (en) 1999-03-30 2001-06-19 Bourns, Inc. Thick film on metal encoder element
TW498602B (en) * 2000-05-30 2002-08-11 Alps Electric Co Ltd Circuit unit
WO2001093314A1 (en) * 2000-05-31 2001-12-06 Dusan Slepcevic Ball grid array with pre-slotted substrate
US20020117753A1 (en) * 2001-02-23 2002-08-29 Lee Michael G. Three dimensional packaging
JP2006173483A (ja) * 2004-12-17 2006-06-29 Fuji Photo Film Co Ltd セラミック集合基板、セラミック基板及びセラミック集合基板の製造方法
JP2008130701A (ja) * 2006-11-20 2008-06-05 Matsushita Electric Ind Co Ltd 配線基板とそれを用いた半導体装置及び半導体装置の製造方法
US7964888B2 (en) * 2007-04-18 2011-06-21 Cree, Inc. Semiconductor light emitting device packages and methods
US20110247197A1 (en) * 2008-01-09 2011-10-13 Feinics Amatech Teoranta Forming channels for an antenna wire of a transponder
US20100006322A1 (en) * 2008-07-09 2010-01-14 Beautiful Card Corporation Sim Card Structure
JP2017073411A (ja) * 2015-10-05 2017-04-13 ソニー株式会社 発光装置
CN109686514B (zh) * 2018-12-24 2020-06-02 河北中瓷电子科技股份有限公司 陶瓷绝缘子线路镀覆方法
CN111945202B (zh) * 2020-07-21 2021-10-15 中国电子科技集团公司第十三研究所 陶瓷无引线外壳的盲孔电镀方法

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US2865082A (en) * 1953-07-16 1958-12-23 Sylvania Electric Prod Semiconductor mount and method
US2966719A (en) * 1954-06-15 1961-01-03 American Lava Corp Manufacture of ceramics
US2893929A (en) * 1955-08-03 1959-07-07 Philco Corp Method for electroplating selected regions of n-type semiconductive bodies
FR1474973A (fr) * 1966-02-16 1967-03-31 Radiotechnique Coprim Rtc Procédé de fabrication d'une couche de contact pour dispositifs semi-conducteurs et produits obtenus
US3423517A (en) * 1966-07-27 1969-01-21 Dielectric Systems Inc Monolithic ceramic electrical interconnecting structure
US3436605A (en) * 1966-11-23 1969-04-01 Texas Instruments Inc Packaging process for semiconductor devices and article of manufacture
US3518756A (en) * 1967-08-22 1970-07-07 Ibm Fabrication of multilevel ceramic,microelectronic structures
US3618202A (en) * 1969-05-12 1971-11-09 Mallory & Co Inc P R Ceramic chip electrical components
US3723176A (en) * 1969-06-19 1973-03-27 American Lava Corp Alumina palladium composite
US3791938A (en) * 1971-11-22 1974-02-12 R Healy Method and apparatus for fabricating selectively plated electrical contacts

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6024093A (ja) * 1984-06-04 1985-02-06 株式会社日立製作所 セラミツク配線基板の製造法
JPS6155280B2 (ja) * 1984-06-04 1986-11-27 Hitachi Ltd
JPS6212189A (ja) * 1985-07-09 1987-01-21 日立エーアイシー株式会社 プリント配線板の製造方法
JPH0362034B2 (ja) * 1985-07-09 1991-09-24 Hitachi Ee Ai Shii Kk

Also Published As

Publication number Publication date
US3926746A (en) 1975-12-16
DE2447284C2 (ja) 1989-03-23
GB1482012A (en) 1977-08-03
JPS6052588B2 (ja) 1985-11-20
DE2447284A1 (de) 1975-04-17

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