JPS5036079A - - Google Patents
Info
- Publication number
- JPS5036079A JPS5036079A JP49073746A JP7374674A JPS5036079A JP S5036079 A JPS5036079 A JP S5036079A JP 49073746 A JP49073746 A JP 49073746A JP 7374674 A JP7374674 A JP 7374674A JP S5036079 A JPS5036079 A JP S5036079A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/101—Integrated devices comprising main components and built-in components, e.g. IGBT having built-in freewheel diode
- H10D84/121—BJTs having built-in components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Bipolar Transistors (AREA)
- Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US374230A US3877063A (en) | 1973-06-27 | 1973-06-27 | Metallization structure and process for semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5036079A true JPS5036079A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-04-04 |
JPS5331715B2 JPS5331715B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1978-09-04 |
Family
ID=23475885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7374674A Expired JPS5331715B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1973-06-27 | 1974-06-27 |
Country Status (6)
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0417072U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1990-06-01 | 1992-02-12 | ||
JP2004349428A (ja) * | 2003-05-21 | 2004-12-09 | Tadahiro Omi | 半導体装置およびその製造方法 |
US8227912B2 (en) | 2004-10-01 | 2012-07-24 | Foundation For Advancement Of International Science | Semiconductor device with Cu metal-base and manufacturing method thereof |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2402304A1 (fr) * | 1977-08-31 | 1979-03-30 | Int Computers Ltd | Procede de connexion electrique d'une pastille de circuit integre |
US4183041A (en) * | 1978-06-26 | 1980-01-08 | Rca Corporation | Self biasing of a field effect transistor mounted in a flip-chip carrier |
JPS5830147A (ja) * | 1981-08-18 | 1983-02-22 | Toshiba Corp | 半導体装置 |
US4459321A (en) * | 1982-12-30 | 1984-07-10 | International Business Machines Corporation | Process for applying closely overlapped mutually protective barrier films |
FR2561444B1 (fr) * | 1984-03-16 | 1986-09-19 | Thomson Csf | Dispositif semi-conducteur hyperfrequence a connexions externes prises au moyen de poutres |
US4829363A (en) * | 1984-04-13 | 1989-05-09 | Fairchild Camera And Instrument Corp. | Structure for inhibiting dopant out-diffusion |
DE69032893T2 (de) * | 1989-11-30 | 1999-07-22 | Kabushiki Kaisha Toshiba, Kawasaki, Kanagawa | Werkstoff für elektrische Leiter, Elektronikagerät welches diesen verwendet und Flüssig-Kristall-Anzeige |
US5156998A (en) * | 1991-09-30 | 1992-10-20 | Hughes Aircraft Company | Bonding of integrated circuit chip to carrier using gold/tin eutectic alloy and refractory metal barrier layer to block migration of tin through via holes |
US5321279A (en) * | 1992-11-09 | 1994-06-14 | Texas Instruments Incorporated | Base ballasting |
US5683939A (en) * | 1993-04-02 | 1997-11-04 | Harris Corporation | Diamond insulator devices and method of fabrication |
US6337151B1 (en) | 1999-08-18 | 2002-01-08 | International Business Machines Corporation | Graded composition diffusion barriers for chip wiring applications |
US20060231919A1 (en) * | 2005-04-15 | 2006-10-19 | Blacka Robert J | Passive microwave device and method for producing the same |
US7538401B2 (en) | 2005-05-03 | 2009-05-26 | Rosemount Aerospace Inc. | Transducer for use in harsh environments |
US7628309B1 (en) * | 2005-05-03 | 2009-12-08 | Rosemount Aerospace Inc. | Transient liquid phase eutectic bonding |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3476531A (en) * | 1966-09-07 | 1969-11-04 | Western Electric Co | Palladium copper contact for soldering |
US3701931A (en) * | 1971-05-06 | 1972-10-31 | Ibm | Gold tantalum-nitrogen high conductivity metallurgy |
US3740523A (en) * | 1971-12-30 | 1973-06-19 | Bell Telephone Labor Inc | Encoding of read only memory by laser vaporization |
-
1973
- 1973-06-27 US US374230A patent/US3877063A/en not_active Expired - Lifetime
-
1974
- 1974-06-21 GB GB2774174A patent/GB1435458A/en not_active Expired
- 1974-06-22 DE DE2430097A patent/DE2430097C3/de not_active Expired
- 1974-06-25 FR FR7422068A patent/FR2235491B1/fr not_active Expired
- 1974-06-26 NL NL7408575A patent/NL7408575A/xx unknown
- 1974-06-27 JP JP7374674A patent/JPS5331715B2/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0417072U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1990-06-01 | 1992-02-12 | ||
JP2004349428A (ja) * | 2003-05-21 | 2004-12-09 | Tadahiro Omi | 半導体装置およびその製造方法 |
US8227912B2 (en) | 2004-10-01 | 2012-07-24 | Foundation For Advancement Of International Science | Semiconductor device with Cu metal-base and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
NL7408575A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1974-12-31 |
US3877063A (en) | 1975-04-08 |
GB1435458A (en) | 1976-05-12 |
DE2430097A1 (de) | 1975-01-16 |
DE2430097B2 (de) | 1978-01-12 |
JPS5331715B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1978-09-04 |
FR2235491B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1978-01-13 |
FR2235491A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1975-01-24 |
DE2430097C3 (de) | 1978-09-07 |