JPS5030428B1 - - Google Patents

Info

Publication number
JPS5030428B1
JPS5030428B1 JP44023840A JP2384069A JPS5030428B1 JP S5030428 B1 JPS5030428 B1 JP S5030428B1 JP 44023840 A JP44023840 A JP 44023840A JP 2384069 A JP2384069 A JP 2384069A JP S5030428 B1 JPS5030428 B1 JP S5030428B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP44023840A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP44023840A priority Critical patent/JPS5030428B1/ja
Priority to US24146A priority patent/US3652904A/en
Priority to DE2015247A priority patent/DE2015247C3/de
Publication of JPS5030428B1 publication Critical patent/JPS5030428B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W40/611—
    • H10W72/00—
    • H10W76/138—

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
  • Electroplating Methods And Accessories (AREA)
JP44023840A 1969-03-31 1969-03-31 Pending JPS5030428B1 (enExample)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP44023840A JPS5030428B1 (enExample) 1969-03-31 1969-03-31
US24146A US3652904A (en) 1969-03-31 1970-03-31 Semiconductor device
DE2015247A DE2015247C3 (de) 1969-03-31 1970-03-31 Halbleiter-Bauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP44023840A JPS5030428B1 (enExample) 1969-03-31 1969-03-31

Publications (1)

Publication Number Publication Date
JPS5030428B1 true JPS5030428B1 (enExample) 1975-10-01

Family

ID=12121578

Family Applications (1)

Application Number Title Priority Date Filing Date
JP44023840A Pending JPS5030428B1 (enExample) 1969-03-31 1969-03-31

Country Status (3)

Country Link
US (1) US3652904A (enExample)
JP (1) JPS5030428B1 (enExample)
DE (1) DE2015247C3 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243227U (enExample) * 1975-09-20 1977-03-28
JPS5278223U (enExample) * 1975-12-09 1977-06-10
JPS5482278U (enExample) * 1977-11-22 1979-06-11

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1381778A (en) * 1972-06-08 1975-01-29 Cableform Ltd Semiconductor clamping means
US4402004A (en) * 1978-01-07 1983-08-30 Tokyo Shibaura Denki Kabushiki Kaisha High current press pack semiconductor device having a mesa structure
JPS5929143B2 (ja) * 1978-01-07 1984-07-18 株式会社東芝 電力用半導体装置
DE3143335A1 (de) * 1981-10-31 1983-05-11 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitervorrichtung
US4646131A (en) * 1983-01-28 1987-02-24 Mitsubishi Denki Kabushiki Kaisha Rectifier device
US5719447A (en) 1993-06-03 1998-02-17 Intel Corporation Metal alloy interconnections for integrated circuits
DE59407080D1 (de) * 1993-08-09 1998-11-19 Siemens Ag Leistungs-Halbleiterbauelement mit Druckkontakt
EP0927433B1 (en) * 1997-07-19 2005-11-16 Koninklijke Philips Electronics N.V. Semiconductor device assemblies and circuits
DE10224124A1 (de) * 2002-05-29 2003-12-18 Infineon Technologies Ag Elektronisches Bauteil mit äußeren Flächenkontakten und Verfahren zu seiner Herstellung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE577086A (enExample) * 1958-04-03 1900-01-01
DE1185728B (de) * 1960-05-18 1965-01-21 Siemens Ag Halbleiteranordnung, insbesondere Flaechengleichrichter oder -transistor mit einem einkristallinen Halbleiterelement
DE1263190B (de) * 1961-07-12 1968-03-14 Siemens Ag Halbleiteranordnung mit einem in ein Gehaeuse eingeschlossenen Halbleiterkoerper
NL291270A (enExample) * 1961-08-12
BE621965A (enExample) * 1961-09-02 1900-01-01
NL286498A (enExample) * 1961-12-30 1900-01-01
NL291606A (enExample) * 1962-04-18
DE1248814B (de) * 1962-05-28 1968-03-14 Siemens Ag Halbleiterbauelement und zugehörige Kühlordnung
DE1279200B (de) * 1964-10-31 1968-10-03 Siemens Ag Halbleiterbauelement
US3396316A (en) * 1966-02-15 1968-08-06 Int Rectifier Corp Compression bonded semiconductor device with hermetically sealed subassembly
US3532941A (en) * 1967-05-23 1970-10-06 Int Rectifier Corp Pressure-assembled semiconductor device having a plurality of semiconductor wafers
US3512053A (en) * 1968-01-25 1970-05-12 Asea Ab Semi-conductor device having means pressing a connector into contact with a semi-conductor disc

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243227U (enExample) * 1975-09-20 1977-03-28
JPS5278223U (enExample) * 1975-12-09 1977-06-10
JPS5482278U (enExample) * 1977-11-22 1979-06-11

Also Published As

Publication number Publication date
DE2015247C3 (de) 1982-07-08
US3652904A (en) 1972-03-28
DE2015247A1 (enExample) 1970-10-08
DE2015247B2 (de) 1972-07-27

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