JPS50103429A - - Google Patents
Info
- Publication number
- JPS50103429A JPS50103429A JP50006945A JP694575A JPS50103429A JP S50103429 A JPS50103429 A JP S50103429A JP 50006945 A JP50006945 A JP 50006945A JP 694575 A JP694575 A JP 694575A JP S50103429 A JPS50103429 A JP S50103429A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/006—Pattern or selective deposits
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating With Molten Metal (AREA)
- Laminated Bodies (AREA)
- Paper (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43352374A | 1974-01-15 | 1974-01-15 | |
US51120374A | 1974-10-02 | 1974-10-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS50103429A true JPS50103429A (sv) | 1975-08-15 |
Family
ID=27029879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50006945A Pending JPS50103429A (sv) | 1974-01-15 | 1975-01-14 |
Country Status (10)
Country | Link |
---|---|
JP (1) | JPS50103429A (sv) |
AR (1) | AR210730A1 (sv) |
AU (1) | AU7707875A (sv) |
CA (1) | CA1033632A (sv) |
DE (2) | DE2501111C3 (sv) |
FR (1) | FR2257701B1 (sv) |
GB (1) | GB1481141A (sv) |
IT (1) | IT1030970B (sv) |
LU (1) | LU71655A1 (sv) |
NL (1) | NL7500202A (sv) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58161756A (ja) * | 1982-03-18 | 1983-09-26 | Nitto Electric Ind Co Ltd | 金属箔のハンダ塗装方法 |
JPS58161755A (ja) * | 1982-03-18 | 1983-09-26 | Nitto Electric Ind Co Ltd | 金属箔のハンダ塗装方法 |
JPS63274749A (ja) * | 1987-05-01 | 1988-11-11 | Nippon Steel Corp | 溶融金属被覆装置の原料供給方法 |
JPH07193358A (ja) * | 1992-12-17 | 1995-07-28 | Dowa Mining Co Ltd | セラミックス電子回路基板の製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2937188A1 (de) * | 1979-09-14 | 1981-03-19 | Norddeutsche Affinerie, 2000 Hamburg | Plattierverfahren |
US6699620B2 (en) * | 2001-07-19 | 2004-03-02 | Delphi Technologies, Inc. | Lead alloy surface coating for positive lead-acid battery grids and methods of use |
DE10333590B4 (de) * | 2003-07-24 | 2005-10-13 | Federal-Mogul Wiesbaden Gmbh & Co. Kg | Gießkammer für ein Verfahren zur Herstellung eines bandförmigen Verbundwerkstoffes |
DE10333591B4 (de) * | 2003-07-24 | 2005-10-13 | Federal-Mogul Wiesbaden Gmbh & Co. Kg | Fließer zum Aufbringen einer Flüssigkeit, insbesondere einer Metallschmelze auf ein Substrat |
-
1974
- 1974-12-19 CA CA216,485A patent/CA1033632A/en not_active Expired
-
1975
- 1975-01-02 AU AU77078/75A patent/AU7707875A/en not_active Expired
- 1975-01-08 NL NL7500202A patent/NL7500202A/xx not_active Application Discontinuation
- 1975-01-09 GB GB892/75A patent/GB1481141A/en not_active Expired
- 1975-01-10 IT IT19187/75A patent/IT1030970B/it active
- 1975-01-13 DE DE2501111A patent/DE2501111C3/de not_active Expired
- 1975-01-13 DE DE2549602A patent/DE2549602C3/de not_active Expired
- 1975-01-14 JP JP50006945A patent/JPS50103429A/ja active Pending
- 1975-01-14 FR FR7500989A patent/FR2257701B1/fr not_active Expired
- 1975-01-15 LU LU71655A patent/LU71655A1/xx unknown
- 1975-01-15 AR AR257311A patent/AR210730A1/es active
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58161756A (ja) * | 1982-03-18 | 1983-09-26 | Nitto Electric Ind Co Ltd | 金属箔のハンダ塗装方法 |
JPS58161755A (ja) * | 1982-03-18 | 1983-09-26 | Nitto Electric Ind Co Ltd | 金属箔のハンダ塗装方法 |
JPS6121306B2 (sv) * | 1982-03-18 | 1986-05-26 | Nitto Electric Ind Co | |
JPS63274749A (ja) * | 1987-05-01 | 1988-11-11 | Nippon Steel Corp | 溶融金属被覆装置の原料供給方法 |
JPH07193358A (ja) * | 1992-12-17 | 1995-07-28 | Dowa Mining Co Ltd | セラミックス電子回路基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
FR2257701B1 (sv) | 1979-10-12 |
DE2501111B2 (de) | 1979-07-12 |
DE2549602C3 (de) | 1979-08-02 |
DE2501111C3 (de) | 1980-03-13 |
NL7500202A (nl) | 1975-07-17 |
GB1481141A (en) | 1977-07-27 |
DE2549602B2 (de) | 1978-12-07 |
DE2549602A1 (de) | 1976-06-10 |
FR2257701A1 (sv) | 1975-08-08 |
DE2501111A1 (de) | 1975-08-21 |
LU71655A1 (sv) | 1975-06-24 |
IT1030970B (it) | 1979-04-10 |
AR210730A1 (es) | 1977-09-15 |
AU7707875A (en) | 1976-07-08 |
CA1033632A (en) | 1978-06-27 |