JPS4977172A - - Google Patents

Info

Publication number
JPS4977172A
JPS4977172A JP48121289A JP12128973A JPS4977172A JP S4977172 A JPS4977172 A JP S4977172A JP 48121289 A JP48121289 A JP 48121289A JP 12128973 A JP12128973 A JP 12128973A JP S4977172 A JPS4977172 A JP S4977172A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48121289A
Other languages
Japanese (ja)
Other versions
JPS5638060B2 (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4977172A publication Critical patent/JPS4977172A/ja
Publication of JPS5638060B2 publication Critical patent/JPS5638060B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W70/688
    • H10W40/778
    • H10W70/453
    • H10W74/124
    • H10W76/134
    • H10W76/157
    • H10W76/40
    • H10W72/07251
    • H10W72/20

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP12128973A 1972-11-02 1973-10-30 Expired JPS5638060B2 (cg-RX-API-DMAC10.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2253627A DE2253627A1 (de) 1972-11-02 1972-11-02 Elektrisches bauelement in mikrotechnik, vorzugsweise halbleiterbauelement

Publications (2)

Publication Number Publication Date
JPS4977172A true JPS4977172A (cg-RX-API-DMAC10.html) 1974-07-25
JPS5638060B2 JPS5638060B2 (cg-RX-API-DMAC10.html) 1981-09-03

Family

ID=5860646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12128973A Expired JPS5638060B2 (cg-RX-API-DMAC10.html) 1972-11-02 1973-10-30

Country Status (6)

Country Link
JP (1) JPS5638060B2 (cg-RX-API-DMAC10.html)
DE (1) DE2253627A1 (cg-RX-API-DMAC10.html)
FR (1) FR2205745B1 (cg-RX-API-DMAC10.html)
GB (1) GB1443028A (cg-RX-API-DMAC10.html)
IT (1) IT996899B (cg-RX-API-DMAC10.html)
NL (1) NL7314802A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272466U (cg-RX-API-DMAC10.html) * 1975-11-26 1977-05-30

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7713758A (nl) * 1977-12-13 1979-06-15 Philips Nv Halfgeleiderinrichting.
US4272644A (en) * 1979-09-27 1981-06-09 Hybrid Systems Corporation Electronic hybrid circuit package
DE2942261A1 (de) * 1979-10-19 1981-04-30 Robert Bosch Gmbh, 7000 Stuttgart Halbleiterbauelement
IT1218271B (it) * 1981-04-13 1990-04-12 Ates Componenti Elettron Procedimento per la fabbricazione di contenitori in plastica con dissipatore termico per circuiti integrati e combinazione di stampo e dissipatori utilizzabile con tale procedimento
DE3138743A1 (de) * 1981-09-29 1983-04-07 Siemens AG, 1000 Berlin und 8000 München In einem dichten gehaeuse montiertes oberflaechenwellenfilter und dergleichen
US5072283A (en) * 1988-04-12 1991-12-10 Bolger Justin C Pre-formed chip carrier cavity package
GB2236213A (en) * 1989-09-09 1991-03-27 Ibm Integral protective enclosure for an assembly mounted on a flexible printed circuit board
DE4224103A1 (de) * 1992-07-22 1994-01-27 Manfred Dr Ing Michalk Miniaturgehäuse mit elektronischen Bauelementen
US5372512A (en) * 1993-04-30 1994-12-13 Hewlett-Packard Company Electrical interconnect system for a flexible circuit
GB2371674A (en) * 2001-01-30 2002-07-31 Univ Sheffield Micro-element package
US8058719B2 (en) 2007-03-23 2011-11-15 Microsemi Corporation Integrated circuit with flexible planer leads
US8018042B2 (en) 2007-03-23 2011-09-13 Microsemi Corporation Integrated circuit with flexible planar leads
CN107534023B (zh) * 2015-05-20 2020-11-06 京瓷株式会社 半导体元件封装件、半导体装置以及安装构造体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS476963U (cg-RX-API-DMAC10.html) * 1971-02-13 1972-09-25
JPS4816345U (cg-RX-API-DMAC10.html) * 1971-07-02 1973-02-23

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS476963U (cg-RX-API-DMAC10.html) * 1971-02-13 1972-09-25
JPS4816345U (cg-RX-API-DMAC10.html) * 1971-07-02 1973-02-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5272466U (cg-RX-API-DMAC10.html) * 1975-11-26 1977-05-30

Also Published As

Publication number Publication date
DE2253627A1 (de) 1974-05-16
JPS5638060B2 (cg-RX-API-DMAC10.html) 1981-09-03
FR2205745B1 (cg-RX-API-DMAC10.html) 1978-08-11
NL7314802A (cg-RX-API-DMAC10.html) 1974-05-06
IT996899B (it) 1975-12-10
FR2205745A1 (cg-RX-API-DMAC10.html) 1974-05-31
GB1443028A (en) 1976-07-21

Similar Documents

Publication Publication Date Title
JPS4961512A (cg-RX-API-DMAC10.html)
FR2205745B1 (cg-RX-API-DMAC10.html)
JPS4938966U (cg-RX-API-DMAC10.html)
JPS4944390U (cg-RX-API-DMAC10.html)
FR2172738A5 (cg-RX-API-DMAC10.html)
JPS4945334U (cg-RX-API-DMAC10.html)
JPS522044Y2 (cg-RX-API-DMAC10.html)
JPS5249748B2 (cg-RX-API-DMAC10.html)
JPS4955109U (cg-RX-API-DMAC10.html)
JPS4994046U (cg-RX-API-DMAC10.html)
CH587055A5 (cg-RX-API-DMAC10.html)
CH582368A5 (cg-RX-API-DMAC10.html)
BG18763A1 (cg-RX-API-DMAC10.html)
BG18696A1 (cg-RX-API-DMAC10.html)
BG19261A1 (cg-RX-API-DMAC10.html)
CH580065A5 (cg-RX-API-DMAC10.html)
NL7316694A (cg-RX-API-DMAC10.html)
CH1125573A4 (cg-RX-API-DMAC10.html)
BG19540A1 (cg-RX-API-DMAC10.html)
CH334172A4 (cg-RX-API-DMAC10.html)
BG18477A1 (cg-RX-API-DMAC10.html)
CH582953A5 (cg-RX-API-DMAC10.html)
BG19449A1 (cg-RX-API-DMAC10.html)
BG18987A1 (cg-RX-API-DMAC10.html)
CH566510A5 (cg-RX-API-DMAC10.html)