JPS495675B1 - - Google Patents

Info

Publication number
JPS495675B1
JPS495675B1 JP45092439A JP9243970A JPS495675B1 JP S495675 B1 JPS495675 B1 JP S495675B1 JP 45092439 A JP45092439 A JP 45092439A JP 9243970 A JP9243970 A JP 9243970A JP S495675 B1 JPS495675 B1 JP S495675B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45092439A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS495675B1 publication Critical patent/JPS495675B1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/006—Processes utilising sub-atmospheric pressure; Apparatus therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
JP45092439A 1969-10-24 1970-10-22 Pending JPS495675B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86929569A 1969-10-24 1969-10-24

Publications (1)

Publication Number Publication Date
JPS495675B1 true JPS495675B1 (ja) 1974-02-08

Family

ID=25353281

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45092439A Pending JPS495675B1 (ja) 1969-10-24 1970-10-22

Country Status (5)

Country Link
US (1) US3652444A (ja)
JP (1) JPS495675B1 (ja)
DE (1) DE2047749A1 (ja)
FR (1) FR2065495B1 (ja)
GB (1) GB1309650A (ja)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3933644A (en) * 1972-03-23 1976-01-20 Varian Associates Sputter coating apparatus having improved target electrode structure
DE2307649B2 (de) * 1973-02-16 1980-07-31 Robert Bosch Gmbh, 7000 Stuttgart Anordnung zum Aufstäuben verschiedener Materialien auf einem Substrat
US3833018A (en) * 1973-02-21 1974-09-03 Pass Port Syst Corp Low leakage vacuum valve and chamber using same
US3925182A (en) * 1973-09-25 1975-12-09 Shatterproof Glass Corp Method for continuous production of sputter-coated glass products
US3981791A (en) * 1975-03-10 1976-09-21 Signetics Corporation Vacuum sputtering apparatus
US4051010A (en) * 1975-12-18 1977-09-27 Western Electric Company, Inc. Sputtering apparatus
US4756815A (en) * 1979-12-21 1988-07-12 Varian Associates, Inc. Wafer coating system
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
US4450062A (en) * 1981-12-22 1984-05-22 Raytheon Company Sputtering apparatus and methods
GB8408023D0 (en) * 1984-03-28 1984-05-10 Gen Eng Radcliffe Ltd Vacuum coating apparatus
US5366554A (en) * 1986-01-14 1994-11-22 Canon Kabushiki Kaisha Device for forming a deposited film
US4747367A (en) * 1986-06-12 1988-05-31 Crystal Specialties, Inc. Method and apparatus for producing a constant flow, constant pressure chemical vapor deposition
US4761269A (en) * 1986-06-12 1988-08-02 Crystal Specialties, Inc. Apparatus for depositing material on a substrate
US4926793A (en) * 1986-12-15 1990-05-22 Shin-Etsu Handotai Co., Ltd. Method of forming thin film and apparatus therefor
US4976996A (en) * 1987-02-17 1990-12-11 Lam Research Corporation Chemical vapor deposition reactor and method of use thereof
DE3827343A1 (de) * 1988-08-12 1990-02-15 Leybold Ag Vorrichtung nach dem karussel-prinzip zum beschichten von substraten
US5261959A (en) * 1988-05-26 1993-11-16 General Electric Company Diamond crystal growth apparatus
US5108779A (en) * 1988-05-26 1992-04-28 General Electric Company Diamond crystal growth process
US4911810A (en) * 1988-06-21 1990-03-27 Brown University Modular sputtering apparatus
US4951603A (en) * 1988-09-12 1990-08-28 Daidousanso Co., Ltd. Apparatus for producing semiconductors
DE3889735T2 (de) * 1988-12-21 1994-09-08 Monkowski Rhine Inc Chemischer dampfniederschlagsreaktor und dessen verwendung.
FR2644567A1 (fr) * 1989-03-17 1990-09-21 Etudes Const Mecaniques Dispositif pour l'execution de traitements thermiques enchaines en continu sous vide
EP0408216A3 (en) * 1989-07-11 1991-09-18 Hitachi, Ltd. Method for processing wafers and producing semiconductor devices and apparatus for producing the same
JP2644912B2 (ja) 1990-08-29 1997-08-25 株式会社日立製作所 真空処理装置及びその運転方法
USRE39756E1 (en) * 1990-08-29 2007-08-07 Hitachi, Ltd. Vacuum processing operating method with wafers, substrates and/or semiconductors
USRE39824E1 (en) * 1990-08-29 2007-09-11 Hitachi, Ltd. Vacuum processing apparatus and operating method with wafers, substrates and/or semiconductors
US7089680B1 (en) 1990-08-29 2006-08-15 Hitachi, Ltd. Vacuum processing apparatus and operating method therefor
US5660693A (en) * 1991-01-18 1997-08-26 Applied Vision Limited Ion vapour deposition apparatus and method
DE4407909C3 (de) * 1994-03-09 2003-05-15 Unaxis Deutschland Holding Verfahren und Vorrichtung zum kontinuierlichen oder quasi-kontinuierlichen Beschichten von Brillengläsern
US5747113A (en) * 1996-07-29 1998-05-05 Tsai; Charles Su-Chang Method of chemical vapor deposition for producing layer variation by planetary susceptor rotation
US6626997B2 (en) 2001-05-17 2003-09-30 Nathan P. Shapiro Continuous processing chamber
US20040065255A1 (en) * 2002-10-02 2004-04-08 Applied Materials, Inc. Cyclical layer deposition system
TW201226607A (en) * 2010-12-21 2012-07-01 Hon Hai Prec Ind Co Ltd Sputtering device
US9748125B2 (en) * 2012-01-31 2017-08-29 Applied Materials, Inc. Continuous substrate processing system
US9808891B2 (en) 2014-01-16 2017-11-07 Taiwan Semiconductor Manufacturing Co., Ltd. Tool and method of reflow
CN108214277B (zh) * 2017-11-28 2019-08-23 中国航发西安动力控制科技有限公司 复杂壳体组件孔系中衬套的珩磨装置及珩磨方法
TWI730406B (zh) * 2018-09-17 2021-06-11 美商先進尼克斯有限公司 真空隔離的批次處理系統

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3314873A (en) * 1962-11-28 1967-04-18 Western Electric Co Method and apparatus for cathode sputtering using a cylindrical cathode
US3428197A (en) * 1966-04-13 1969-02-18 Ibm Vacuum entry mechanism

Also Published As

Publication number Publication date
FR2065495A1 (ja) 1971-07-30
US3652444A (en) 1972-03-28
GB1309650A (en) 1973-03-14
FR2065495B1 (ja) 1973-01-12
DE2047749A1 (de) 1971-05-06

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