JPS494994A - - Google Patents
Info
- Publication number
- JPS494994A JPS494994A JP47042425A JP4242572A JPS494994A JP S494994 A JPS494994 A JP S494994A JP 47042425 A JP47042425 A JP 47042425A JP 4242572 A JP4242572 A JP 4242572A JP S494994 A JPS494994 A JP S494994A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47042425A JPS494994A (https=) | 1972-04-27 | 1972-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47042425A JPS494994A (https=) | 1972-04-27 | 1972-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS494994A true JPS494994A (https=) | 1974-01-17 |
Family
ID=12635694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47042425A Pending JPS494994A (https=) | 1972-04-27 | 1972-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS494994A (https=) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5132954A (https=) * | 1974-09-13 | 1976-03-19 | Nippon Electric Co | |
| JPS51127680A (en) * | 1975-04-28 | 1976-11-06 | Toshiba Corp | Manufacturing process of semiconductor device |
| JPS5430296U (https=) * | 1977-08-02 | 1979-02-27 | ||
| JPS54104286A (en) * | 1978-02-02 | 1979-08-16 | Matsushita Electric Ind Co Ltd | Integrated circuit device |
| JPS5527643A (en) * | 1978-08-17 | 1980-02-27 | Nec Corp | Semiconductor device |
| JPS5616936U (https=) * | 1979-07-17 | 1981-02-14 | ||
| JPS5896726A (ja) * | 1981-12-05 | 1983-06-08 | Konishiroku Photo Ind Co Ltd | アモルフアスシリコン半導体装置 |
| JPS58137233A (ja) * | 1982-02-09 | 1983-08-15 | Mitsubishi Electric Corp | 半導体装置 |
| JPS60211846A (ja) * | 1984-04-05 | 1985-10-24 | Fuji Electric Corp Res & Dev Ltd | 多層絶縁膜の形成方法 |
| JPS62216247A (ja) * | 1987-03-05 | 1987-09-22 | Nec Corp | 集積回路の接続法 |
| JPS62224942A (ja) * | 1986-03-27 | 1987-10-02 | Sony Corp | 半導体集積回路 |
-
1972
- 1972-04-27 JP JP47042425A patent/JPS494994A/ja active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5132954A (https=) * | 1974-09-13 | 1976-03-19 | Nippon Electric Co | |
| JPS51127680A (en) * | 1975-04-28 | 1976-11-06 | Toshiba Corp | Manufacturing process of semiconductor device |
| JPS5430296U (https=) * | 1977-08-02 | 1979-02-27 | ||
| JPS54104286A (en) * | 1978-02-02 | 1979-08-16 | Matsushita Electric Ind Co Ltd | Integrated circuit device |
| JPS5527643A (en) * | 1978-08-17 | 1980-02-27 | Nec Corp | Semiconductor device |
| JPS5616936U (https=) * | 1979-07-17 | 1981-02-14 | ||
| JPS5896726A (ja) * | 1981-12-05 | 1983-06-08 | Konishiroku Photo Ind Co Ltd | アモルフアスシリコン半導体装置 |
| JPS58137233A (ja) * | 1982-02-09 | 1983-08-15 | Mitsubishi Electric Corp | 半導体装置 |
| JPS60211846A (ja) * | 1984-04-05 | 1985-10-24 | Fuji Electric Corp Res & Dev Ltd | 多層絶縁膜の形成方法 |
| JPS62224942A (ja) * | 1986-03-27 | 1987-10-02 | Sony Corp | 半導体集積回路 |
| JPS62216247A (ja) * | 1987-03-05 | 1987-09-22 | Nec Corp | 集積回路の接続法 |