JPS494994A - - Google Patents
Info
- Publication number
- JPS494994A JPS494994A JP47042425A JP4242572A JPS494994A JP S494994 A JPS494994 A JP S494994A JP 47042425 A JP47042425 A JP 47042425A JP 4242572 A JP4242572 A JP 4242572A JP S494994 A JPS494994 A JP S494994A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4807—Shape of bonding interfaces, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4845—Details of ball bonds
- H01L2224/48451—Shape
- H01L2224/48453—Shape of the interface with the bonding area
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47042425A JPS494994A (ja) | 1972-04-27 | 1972-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47042425A JPS494994A (ja) | 1972-04-27 | 1972-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS494994A true JPS494994A (ja) | 1974-01-17 |
Family
ID=12635694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47042425A Pending JPS494994A (ja) | 1972-04-27 | 1972-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS494994A (ja) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5132954A (ja) * | 1974-09-13 | 1976-03-19 | Nippon Electric Co | Kosahaisenojusuruhakumakukairokiban oyobi sonoseizohoho |
| JPS51127680A (en) * | 1975-04-28 | 1976-11-06 | Toshiba Corp | Manufacturing process of semiconductor device |
| JPS5430296U (ja) * | 1977-08-02 | 1979-02-27 | ||
| JPS54104286A (en) * | 1978-02-02 | 1979-08-16 | Matsushita Electric Ind Co Ltd | Integrated circuit device |
| JPS5527643A (en) * | 1978-08-17 | 1980-02-27 | Nec Corp | Semiconductor device |
| JPS5616936U (ja) * | 1979-07-17 | 1981-02-14 | ||
| JPS5896726A (ja) * | 1981-12-05 | 1983-06-08 | Konishiroku Photo Ind Co Ltd | アモルフアスシリコン半導体装置 |
| JPS58137233A (ja) * | 1982-02-09 | 1983-08-15 | Mitsubishi Electric Corp | 半導体装置 |
| JPS60211846A (ja) * | 1984-04-05 | 1985-10-24 | Fuji Electric Corp Res & Dev Ltd | 多層絶縁膜の形成方法 |
| JPS62216247A (ja) * | 1987-03-05 | 1987-09-22 | Nec Corp | 集積回路の接続法 |
| JPS62224942A (ja) * | 1986-03-27 | 1987-10-02 | Sony Corp | 半導体集積回路 |
-
1972
- 1972-04-27 JP JP47042425A patent/JPS494994A/ja active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5820159B2 (ja) * | 1974-09-13 | 1983-04-21 | 日本電気株式会社 | 交叉配線を有する薄膜回路基板の製造方法 |
| JPS5132954A (ja) * | 1974-09-13 | 1976-03-19 | Nippon Electric Co | Kosahaisenojusuruhakumakukairokiban oyobi sonoseizohoho |
| JPS51127680A (en) * | 1975-04-28 | 1976-11-06 | Toshiba Corp | Manufacturing process of semiconductor device |
| JPS5430296U (ja) * | 1977-08-02 | 1979-02-27 | ||
| JPS54104286A (en) * | 1978-02-02 | 1979-08-16 | Matsushita Electric Ind Co Ltd | Integrated circuit device |
| JPS5527643A (en) * | 1978-08-17 | 1980-02-27 | Nec Corp | Semiconductor device |
| JPS5616936U (ja) * | 1979-07-17 | 1981-02-14 | ||
| JPS5896726A (ja) * | 1981-12-05 | 1983-06-08 | Konishiroku Photo Ind Co Ltd | アモルフアスシリコン半導体装置 |
| JPS58137233A (ja) * | 1982-02-09 | 1983-08-15 | Mitsubishi Electric Corp | 半導体装置 |
| JPS60211846A (ja) * | 1984-04-05 | 1985-10-24 | Fuji Electric Corp Res & Dev Ltd | 多層絶縁膜の形成方法 |
| JPS62224942A (ja) * | 1986-03-27 | 1987-10-02 | Sony Corp | 半導体集積回路 |
| JPS62216247A (ja) * | 1987-03-05 | 1987-09-22 | Nec Corp | 集積回路の接続法 |
| JPH0315338B2 (ja) * | 1987-03-05 | 1991-02-28 | Nippon Electric Co |